Littelfuse SP725 Series - Manual (Page 6)

© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/24/13
TVS Diode Arrays
(SPA ® Diodes)
General Purpose ESD Protection - SP725 Series
Part Numbering System Product Characteristics
Ordering Information
Embossed Carrier Tape & Reel Specification - SOIC Package
Part Number Temp. Range (ºC) Package Marking Min. Order Qty.
SP725ABG -40 to 105 8 Ld SOIC SP725AB(T)G 1 1960
SP725ABTG -40 to 105 8 Ld SOIC Tape and Reel SP725AB(T)G 1 2500
SP 725 AB
Series
Package Type
AB: 8 Leaded SOIC
TG=Tape and Reel
G=Green
TVS Diode Arrays
(SPA ® Diodes)
* Lead Plating Matte Tin
Lead Material Copper Alloy
Lead Coplanarity 0.004 inches (0.102mm)
Substitute Material Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
Notes:
1. All dimensions are in millimeters.
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4.Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
User Feeding Direction
Pin 1 Location
Symbol
Millimetres Inches
Min Max Min Max
E 1.65 1.85 0.065 0.073
F 5.4 5.6 0.213 0.22
P2 1.95 2.05 0.077 0.081
D 1.5 1.6 0.059 0.063
D1 1.50 Min 0.059 Min
P0 3.9 4.1 0.154 0.161
10P0 40.0 ± 0.20 1.574 ± 0.008
W 11.9 12.1 0.468 0.476
P 7.9 8.1 0.311 0.319
A0 6.3 6.5 0.248 0.256
B0 5.1 5.3 0.2 0.209
K0 2 2.2 0.079 0.087
t 0.30 ± 0.05 0.012 ± 0.002
Notes:
1. SP725AB(T)G means device marking either SP725ABG or SP725ABTG.