GE Industrial Solutions Austin Minilynx SMT - Manual (Page 18)

Data Sheet
September 10, 2013 Austin MiniLynx TM SMT Non-isolated Power Modules:
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 3A output current
LINEAGE POWER 18
Surface Mount Information
Pick and Place
The Austin MiniLynx TM SMT modules use an open
frame construction and are designed for a fully
automated assembly process. The modules are fitted
with a label designed to provide a large surface area
for pick and placing. The label meets all the
requirements for surface mount processing, as well as
safety standards and is able to withstand maximum
reflow temperature. The label also carries product
information such as product code, serial number and
location of manufacture.
Figure 36. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and pick &
placement speed should be considered to optimize
this process. The minimum recommended nozzle
diameter for reliable operation is 3mm. The maximum
nozzle outer diameter, which will safely fit within the
allowable component spacing, is 8 mm max.
Tin Lead Soldering
The Austin MiniLynx TM SMT power modules are lead
free modules and can be soldered either in a lead-free
solder process or a conventional Tin/Lead (Sn/Pb)
process. It is recommended that the customer review
data sheets in order to customize the solder reflow
profile for each application board assembly. The
following instructions must be observed when
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
The Austin MiniLynx
TM SMT power modules are lead
free modules and can be soldered either in a lead-free
solder process or a conventional Tin/Lead (Sn/Pb)
process. It is recommended that the customer review
data sheets in order to customize the solder reflow
profile for each application board assembly. The
following instructions must be observed when
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
REF
L
O
W
T
E
MP
(°
C)
0
50
100
150
200
250
300
Preheat zo ne
max 4
o Cs -1
Soak zo ne
30-240s
Heat zone
max 4
o Cs -1
Peak Temp 235 o C
Co oling
zone
1-4
o Cs -1
T
lim
above
205 o C
REFLOW TIME (S)
Figure 37. Reflow Profile for Tin/Lead (Sn/Pb)
process.
M
AX TE
M
P
S
O
LD
ER
(°
C)
200
205
210
215
220
225
230
235
240
0 10 20 30 40 50 60
Figure 38. Time Limit Curve Above 205 o C Reflow
for Tin Lead (Sn/Pb) process.