GE Industrial Solutions SHHD005A0F Hammerhead Series - Manual (Page 11)

GE Data Sheet
SHHD005A0F Hammerhead Series; DC-DC Converter Power Modules
18-75Vdc Input; 3.3Vdc, 5A, 15W Output
June 26, 2013 ©2012 General Electric Company. All rights reserved. Page 11
Surface Mount Information (continued)
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices) for both Pb-free solder
profiles and MSL classification procedures. This standard
provides a recommended forced-air-convection reflow profile
based on the volume and thickness of the package (table 4-2).
The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The
recommended linear reflow profile using Sn/Ag/Cu solder is
shown in Figure 22.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit board assembly
process prior to electrical board testing. The result of
inadequate cleaning and drying can affect both the reliability
of a power module and the testability of the finished circuit
board assembly. For guidance on appropriate soldering,
cleaning and drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning Application
Note (AN04-001).
Layout Recommendations
Dimensions are in millimeters and [inches].
Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (unless otherwise indicated)
x.xx mm  0.25 mm [x.xxx in  0.010 in.]
SMT Layout
Through Hole Layout