GE Industrial Solutions JRW017-040-060-065-070 Series - Manual (Page 21)

Data Sheet
June 14, 2010
JRW017-070 Series Power Modules DC-DC Converters
36-75Vdc Input; 1.2Vdc to 12Vdc Output
LINEAGE POWER 21
Layout Considerations
The JRW power module series are low profile in order
to be used in fine pitch system and architectures. As
such, component clearances between the bottom of
the power module and the mounting board are limited.
Either avoid placing copper areas on the outer layer
directly underneath the power module or maintain a
minimum clearance through air of 0.028 inches
between any two “opposite polarity” components,
including copper traces under the module to
components on the JRW module..
For modules with a “7” (case (heatplate) pin) and “-H”
(heatplate) option:
To meet Basic Insulation in the end product 1)
between the input and output of the module, or 2)
between the input and the earth ground, a series
capacitor (capable of withstanding 1500V dc) needs
to inserted between the case pin and the end
termination point, if the case pin is connected to the
input or the output of the JRW module or to earth
ground.
For additional layout guide-lines, refer to
FLTR100V10 data sheet.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AP01-056EPS).
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3
°C/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210
°C. For Pb solder, the recommended pot
temperature is 260
°C, while the Pb-free solder pot is
270
°C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information
is needed, please consult with your Lineage Power
representative for more details.