Diodes SBR2U30P1 - Manual (Page 2)

SBR2U30P1
Document number: DS30706 Rev. 7 - 2
2 of 5
www.diodes.com
March 2012
© Diodes Incorporated
SBR2U30P1
SBR and POWERDI are registered trademarks of Diodes Incorporated.
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage V
RRM
V
RWM
V RM
30 V
RMS Reverse Voltage V
R(RMS)
21 V
Average Rectified Output Current (See Figure 1) I
O
2.0 A
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
I
FSM
75 A
Non-Repetitive Avalanche Energy
(T
J = 25°C, I AS = 5A, L = 8.5 mH)
E
AS
105 mJ
Repetitive Peak Avalanche Energy
(T
P
= 1µs, T
J
= 25°C)
P
ARM
1100 W
Thermal Characteristics
Characteristic Symbol Value Unit
Maximum Thermal Resistance
Thermal Resistance Junction to Soldering (Note 3)
Thermal Resistance Junction to Ambient (Note 4)
Thermal Resistance Junction to Ambient (Note 5)
R θJS
R θJA
R θJA
5
178
123
ºC/W
Operating and Storage Temperature Range T
J
, T
STG
-65 to +150 ºC
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 6) V
(BR)R
30 - - V I
R
= 400µA
Forward Voltage Drop V F
- 0.22 0.26
V
I
F
= 0.1A, T
J
= 25ºC
- 0.31 0.35 I F = 1.0A, T J = 25ºC
- 0.36 0.40 I
F
= 2.0A, T
J
= 25ºC
- 0.12 0.15 I
F
= 0.1A, T
J
= 125ºC
- 0.27 0.30 I F = 1.0A, T J = 125ºC
- 0.30 0.33 I
F
= 2.0A, T
J
= 125ºC
Leakage Current (Note 6) I
R
- 75 150 µA V
R
= 5V, T
J
= 25ºC
- 150 400 µA V
R
= 30V, T
J
= 25ºC
- 6 15 mA V R = 5V, T J = 125ºC
- 12 20 mA V
R
= 30V, T
J
= 125ºC
Notes: 3. Theoretical R θJS calculated from the top center of the die straight down to the PCB cathode tab solder junction.
4. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
5. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
6. Short duration pulse test used to minimize self-heating effect.