Zhcs1000, Package outline dimensions, Suggested pad layout – Diodes ZHCS1000 User Manual
Page 4
ZHCS1000
Document number: DS33220 Rev. 4 - 2
4 of 5
December 2013
© Diodes Incorporated
ZHCS1000
MAXIMUM TRANSIENT THERMAL RESISTANCE*
* Devices were mounted on a 15mmx15mm ceramic substrate.
Package Outline Dimensions
Suggested Pad Layout
SOT23
Dim Min Max Typ
A
0.37 0.51 0.40
B
1.20 1.40 1.30
C
2.30 2.50 2.40
D
0.89 1.03 0.915
F
0.45 0.60 0.535
G
1.78 2.05 1.83
H
2.80 3.00 2.90
J
0.013 0.10 0.05
K
0.890 1.00 0.975
K1
0.903 1.10 1.025
L
0.45 0.61 0.55
L1
0.25 0.55 0.40
M
0.085 0.150 0.110
a
8°
All Dimensions in mm
Dimensions Value (in mm)
Z
2.9
X
0.8
Y
0.9
C
2.0
E
1.35
X
E
Y
C
Z
J
K 1
K
L 1
H
L
M
A l l 7 °
A
C
B
D
a