Diodes SDM03U40 User Manual

Sdm03u40, Features, Mechanical data

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SDM03U40

Document number: DS30392 Rev. 9 - 2

1 of 3

www.diodes.com

January 2009

© Diodes Incorporated

SDM03U40


SURFACE MOUNT SCHOTTKY BARRIER DIODE

Features

•

Low Forward Voltage Drop

•

Guard Ring Die Construction for Transient Protection

•

Ideal for low logic level applications

•

Low Capacitance

•

Lead Free by Design/RoHS Compliant (Note 1)

•

"Green" Device, Note 4 and 5

•

Qualified to AEC-Q101 Standards for High Reliability

Mechanical Data

• Case:

SOD-523

•

Case Material: Molded Plastic, "Green" Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0

•

Moisture Sensitivity: Level 1 per J-STD-020D

•

Terminal Connections: Cathode Band

•

Terminals: Finish - Matte Tin annealed over Alloy 42 leadframe.
Solderable per MIL-STD-202, Method 208

•

Marking Information: See Page 3

•

Ordering Information: See Page 3

•

Weight: 0.002 grams (approximate)









Maximum Ratings

@T

A

= 25°C unless otherwise specified

Characteristic

Symbol

Value

Unit

Peak Reverse Voltage

V

RM

40

V

DC Reverse Voltage

V

R

30

V

RMS Reverse Voltage

V

R(RMS)

21

V

Average Rectified Current

I

O

30

mA

Non-Repetitive Peak Forward Surge Current @8.3ms
Single half sine-wave superimposed on rated load

I

FSM

200

mA

Thermal Characteristics

Characteristic

Symbol

Value

Unit

Power Dissipation (Note 2)

P

D

150

mW

Thermal Resistance, Junction to Ambient (Note 2)

R

θJA

667

°C/W

Operating and Storage Temperature Range

T

J,

T

STG

-40 to +125

°C

Electrical Characteristics

@T

A

= 25°C unless otherwise specified

Characteristic

Symbol

Min

Typ

Max

Unit

Test Conditions

Reverse Breakdown Voltage (Note 3)

V

(BR)R

40

⎯

⎯

V

I

R = 10

uA

Forward Voltage

V

F

⎯

290

370

mV

I

F

= 1mA

Peak Reverse Current (Note 3)

I

R

⎯

⎯

0.5

μA

V

R

= 30V

Total Capacitance

C

T

⎯

2

⎯

pF

V

R

= 1V, f = 1.0 MHz

Notes:

1. No purposefully added lead.
2. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. Short duration pulse test used to minimize self-heating effect.
4. Diodes Inc.'s "Green" Policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with date code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to date

code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.














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