Diodes SDM10K45 User Manual
Sdm10k45, Features, Mechanical data
SDM10K45
Document number: DS30256 Rev. 15 - 2
1 of 4
June 2010
© Diodes Incorporated
SDM10K45
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Features
•
Fast Switching Speed
•
Ultra-Small Surface Mount Package
•
For General Purpose Switching Applications
• High
Conductance
•
Lead, Halogen and Antimony Free, RoHS Compliant "Green"
Device (Notes 3 and 4)
•
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
• Case:
SOD-323
•
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
•
Moisture Sensitivity: Level 1 per J-STD-020
•
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating).Solderable per MIL-STD-202, Method 208
•
Polarity: Cathode Band
•
Marking Information: See Page 2
•
Ordering Information: See Page 2
•
Weight: 0.006 grams (approximate)
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
R
45 V
RMS Reverse Voltage
V
R(RMS)
40 V
Forward Continuous Current (Note 1)
I
FM
100 mA
Forward Surge Current
@ t < 8.3ms
I
FSM
1.0 A
Thermal Characteristics
Characteristic Symbol
Value
Unit
Power Dissipation (Note 1)
P
D
200 mW
Thermal Resistance Junction to Ambient Air (Note 1)
R
θJA
500
°C/W
Operating and Storage Temperature Range (Note 5)
T
J
, T
STG
-40 to +150
°C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic Symbol
Min
Typ
Max
Unit
Test
Condition
Reverse Breakdown Voltage (Note 2)
V
(BR)R
45
⎯
⎯
⎯
I
R
= 100
μA
Forward Voltage
V
F
⎯
370 450 mV
I
F
= 10mA
Reverse Leakage Current (Note 2)
I
R
⎯
0.07 1.0
μA
V
R
= 10V
Total Capacitance
C
T
⎯
6.0
⎯
pF
V
R
= 10V, f = 1.0MHz
Notes:
1. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our
website at
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead. Halogen and Antimony Free.
4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code
V9 are built with Non-Green Molding Compound and may contain Halogens or Sb
2
O
3
Fire Retardants.
5. The heat generated must be less than the thermal conductivity from Junction-to-Ambient: dP
D
/dT
J
< 1/R
θJA
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