Diodes SDM10U45 - Manual

SDM10U45
Document number: DS30394 Rev. 12 - 2
1 of 3
www.diodes.com
January 2009
© Diodes Incorporated
SDM10U45
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Features
•
Low Forward Voltage Drop
• Guard Ring Construction for Transient Protection
•
Ideal for Low Logic Level Applications
• Low
Capacitance
• Lead Free By Design/RoHS Compliant (Note 1)
• Qualified to AEC-Q101 Standards for High Reliability
•
"Green" Device, Notes 4 and 5
Mechanical Data
• Case:
SOD-523
• Case Material: Molded Plastic, "Green" Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
•
Terminal Connections: Cathode Band
•
Terminals: Finish - Matte Tin annealed over Alloy 42
leadframe. Solderable per MIL-STD-202, Method 208
•
Marking Information: See Page 2
•
Ordering Information: See Page 2
• Weight: 0.002 grams (approximate)
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Unit
Maximum Peak Reverse Voltage V
RM
45 V
Reverse Voltage V
R
40 V
RMS Reverse Voltage V
R(RMS)
28 V
Average Forward Current I O
100 mA
Maximum (Peak) Forward Current I FM
300 mA
Non-Repetitive Peak Forward Surge Current @ t ≤ 10ms
I FSM
1 A
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 2) P D
150 mW
Thermal Resistance, Ambient Air (Note 2) R θJA 667 °C/W
Operating and Storage Temperature Range T
J,
T
STG
-40 to +125 °C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Conditions
Reverse Breakdown Voltage (Note 3) V
(BR)R
30 ⎯ ⎯ V I
R
= 100 μA
Forward Voltage Drop V F
⎯
280
360
470
580 ⎯
⎯
550
800
mV
I
F
= 1.0mA
I F = 15mA
I F = 50mA
I
F
= 100mA
Reverse Current (Note 3) I
R
⎯ ⎯ 1.0 μA
V
R
= 25V
Total Capacitance C
T
⎯ 4 15 pF V
R
= 10V, f = 1.0 MHz
Notes: 1. No purposefully added lead.
2. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf. @ T
A
= 25°C.
3. Short duration pulse test used so as to minimize self-heating effect.
4. Diodes Inc.'s "Green" Policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with date code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to date
code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
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