Diodes SDM20U30 - Manual

SDM20U30
Document number: DS30397 Rev. 10 - 2
1 of 3
www.diodes.com
January 2009
© Diodes Incorporated
SDM20U30
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Features
•
Low Forward Voltage Drop
• Guard Ring Construction for Transient Protection
•
Negligible Reverse Recovery Time
• Low
Capacitance
• Ultra-Small Surface Mount Package
• Lead Free By Design/RoHS Compliant (Note 1)
•
"Green" Device, (Notes 4 and 5)
•
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
•
Case: SOD-523
• Case Material: Molded Plastic, "Green" Molding
Compound, Note 5. UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
•
Terminal Connections: Cathode Band
•
Terminals: Finish - Matte Tin annealed over Alloy 42 leadframe.
Solderable per MIL-STD-202, Method 208
•
Marking Information: See Page 2
•
Ordering Information: See Page 2
• Weight: 0.002 grams (approximate)
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage V
RRM
V
RWM
V
R
30 V
RMS Reverse Voltage V
R(RMS)
21 V
Mean Rectifying Current (Note 2) I
O
200 mA
Peak Forward Surge Current @ 8.3ms Half Sine I FSM
1.0 A
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 2) P
D
150 mW
Thermal Resistance, Junction to Ambient Air (Note 2) R θJA 667 °C/W
Operating and Storage Temperature Range T
J
, T
STG
-65 to +125 °C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Conditions
Reverse Breakdown Voltage (Note 3) V
(BR)R
30 ⎯ ⎯ V I
R
= 150 μA
Forward Voltage Drop V
F
⎯ ⎯
0.35
0.50
V
I
F
= 20mA
I
F
= 200mA
Peak Reverse Current (Note 3) I
R
⎯ ⎯
150
30
μA
μA V
R
= 30V
V R = 10V
Total Capacitance C T
⎯ 20 ⎯ pF V R = 0V, f = 1.0MHz
Notes: 1. No purposefully added lead.
2. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. Short duration pulse test used to minimize self-heating effect.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
Top View
Please click here to visit our online spice models database.