Diodes SDMP0340LT /LST /LCT /LAT User Manual

Sdmp0340lt /lst /lct /lat, Features, Mechanical data

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SDMP0340LT /LST /LCT /LAT


SURFACE MOUNT SCHOTTKY BARRIER DIODE

Features

Low Forward Voltage Drop

Guard Ring Die Construction for Transient Protection

Ideal for Low Logic Level Applications

Low Capacitance

Lead Free/RoHS Compliant (Note 3)

"Green" Device (Note 4 and 5)

Mechanical Data

Case: SOT-523

Case Material: Molded Plastic. UL Flammability Classification
Rating: 94V-0

Moisture Sensitivity: Level 1 per J-STD-020D

Terminals: Solderable per MIL-STD-202, Method 208

Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).

Polarity: See Diagrams Below

Marking Information: See Page 3

Ordering Information: See Page 3

Weight: 0.002 grams (approximate)

Top View

SDMP0340LT SDMP0340LAT SDMP0340LCT SDMP0340LST

Maximum Ratings

@T

A

= 25°C unless otherwise specified

Characteristic

Symbol

Value

Unit

Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage

V

RRM

V

RWM

V

R

40

V

RMS Reverse Voltage

V

R(RMS)

28

V

Forward Continuous Current (Note 1)

I

FM

30

mA

Non-Repetitive Peak Forward Surge Current @8.3ms
Single half sine-wave superimposed on rated load

I

FSM

200

mA

Thermal Characteristics

Characteristic

Symbol

Value

Unit

Power Dissipation (Note 1)

P

D

150

mW

Thermal Resistance, Junction to Ambient (Note 1)

R

θJA

833

°C/W

Operating and Storage Temperature Range

T

J,

T

STG

-40 to +125

°C

Electrical Characteristics

@T

A

= 25°C unless otherwise specified

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

Reverse Breakdown Voltage (Note 2)

V

(BR)R

40

V

I

R =

10

uA

Forward Voltage Drop

V

F

290

370

mV

I

F

= 1mA

Leakage Current (Note 2)

I

R

1.0

μA

V

R

= 10V

Total Capacitance

C

T

2

pF

V

R

= 1V, f = 1.0 MHz

Notes:

1. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date

Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.







SDMP0340LT /LST /LCT /LAT

Document number: DS30266 Rev. 11 - 2

1 of 4

www.diodes.com

July 2008

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