Diodes SDA006 User Manual

Features, Iec compatibility, Mechanical data

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SDA006

Document number: DS30559 Rev. 6 - 2

1 of 4

www.diodes.com

April 2008

© Diodes Incorporated

SDA006

DATA BUS TRANSIENT SUPPRESSOR / 3-PHASE FULL WAVE BRIDGE RECTIFIER

Features

Fast Switching Speed

Ultra-Small Surface Mount Package

For 3-Phase Full Wave Bridge Rectification, or 3 Dataline Rail
Clamp

Lead Free By Design/RoHS Compliant (Note 3)

"Green" Device (Note 4)

IEC Compatibility

(Note 5)

61000-4-2 (ESD) Air-10kV Contact-8kV

61000-4-5 (Surge) 8x20

μs, 14.5 Amperes

Mechanical Data

Case: SOT-363

Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0 (Note 4)

Moisture Sensitivity: Level 1 per J-STD-020D

Terminals: Finish

⎯ Matte Tin annealed over Alloy 42

Leadframe. Solderable per MIL-STD-202, Method 208

Marking Information: See Page 3

Ordering Information: See Page 3

Weight: 0.006 grams (approximate)

DC

V

+

CC

DC

V

+

CC

AC
DL

3

3

/

/

/

/

/

/

DL
AC

1

1

DL
AC

2

2

GND
DC-

SOT-363

Internal Schematic

TOP VIEW

TOP VIEW

Maximum Ratings

@T

A

= 25°C unless otherwise specified

Characteristic

Symbol

Value

Unit

Non-Repetitive Peak Reverse Voltage

V

RM

100

V

Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage

V

RRM

V

RWM

V

R

75

V

RMS Reverse Voltage

V

R(RMS)

53

V

Forward Continuous Current (Note 1)

I

FM

215

mA

Non-Repetitive Peak Forward Surge Current @ t = 1.0

μs

@ t = 1.0ms
@ t = 1.0s

I

FSM

2.0
1.0
0.5

A

Clamping Voltage (Note 6) @ Ipp = 14.5A
8x20

μs Waveform

V

C

16 V

Thermal Characteristics

Characteristic

Symbol

Value

Unit

Power Dissipation (Note 1)

P

D

200

mW

Power Dissipation (Note 2)

P

D

300

mW

Thermal Resistance Junction to Ambient Air (Note 1)

R

θJA

625

°C/W

Thermal Resistance Junction to Ambient Air (Note 2)

R

θJA

417

°C/W

Operating and Storage Temperature Range

T

J

, T

STG

-65 to +150

°C

Notes:

1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Device mounted on Alumina PCB, 0.4 inch x 0.3 inch x 0.024 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Tested with V

CC

connected to Ground to simulate appropriate V

CC

decoupling to Ground.

6. Reference to V

CC

or Ground.














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