Maximum ratings, Thermal characteristics – Diodes ZXTN07045EFF User Manual

Page 2

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ZXTN07045EFF

Document number: DS33674 Rev. 4 - 2

2 of 7

www.diodes.com

February 2012

© Diodes Incorporated

A Product Line of

Diodes Incorporated

ZXTN07045EFF







Maximum Ratings

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Value

Unit

Collector-Base Voltage

V

CBO

45 V

Collector-Emitter Voltage

V

CEO

45 V

Emitter-Collector Voltage (Reverse Blocking)

V

ECO

6 V

Emitter-Base Voltage

V

EBO

7 V

Continuous Collector Current

(Note 6)

I

C

4 A

Peak Pulse Current

I

CM

6 A

Base Current

I

B

1 A




Thermal Characteristics

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Value

Unit

Power Dissipation
Linear Derating Factor

(Note 4)

P

D

-

0.84
6.72

W

mW/

°C

(Note 5)

1.34

10.72

(Note 6)

1.50
12.0

(Note 7)

2.0

16.0

Thermal Resistance, Junction to Ambient

(Note 4)

R

θJA

149

°C/W

(Note 5)

93

(Note 6)

83

(Note 7)

60

Thermal Resistance, Junction to Lead

(Note 8)

R

θJL

43.77

°C/W

Operating and Storage Temperature Range

T

J,

T

STG

-55 to +150

°C

Notes:

4. For a device surface mounted on 15mm X 15mm X 1.6mm FR4 PCB with high coverage of single sided 1 oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
5. For a device surface mounted on 25mm X 25mm X 1.6mm FR4 PCB with high coverage of single sided 2 oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
6. For a device surface mounted on 50mm X 50mm X 1.6mm FR4 PCB with high coverage of single sided 2 oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
7. As note 6 above, measured at t < 5 seconds
8. Thermal resistance from junction to solder-point (at the end of the collector lead).

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