Zxmn2a01f advanced information, Electrical characteristics, Zxmn2a01f – Diodes ZXMN2A01F User Manual

Page 3

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ZXMN2A01F

Document number: DS33513 Rev. 3 - 2

3 of 7

www.diodes.com

March 2014

© Diodes Incorporated

ZXMN2A01F

ADVANCED INFORMATION



Electrical Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Min

Typ

Max

Unit

Test

Condition

OFF CHARACTERISTICS
Drain-Source Breakdown Voltage

BV

DSS

20

V

V

GS

= 0V,

I

D

= 250µA

Zero Gate Voltage Drain Current

I

DSS

1 µA

V

DS

= 20V,

V

GS

= 0V

Gate-Body Leakage

I

GSS

100 nA

V

GS

=

±

12V,

V

DS

= 0V

ON CHARACTERISTICS
Gate Threshold Voltage

V

GS(th)

0.7

V

V

DS

= V

GS

,

I

D

= 250µA

Static Drain-Source On-Resistance (Note 8)

R

DS(ON)

0.12

V

GS

= 4.5V,

I

D

= 4A



0.225



V

GS

= 2.5V,

I

D

= 1.5A

Forward Transconductance

g

FS

6.1

S

V

DS

= 10V,

I

D

= 4A

Diode Forward Voltage (Note 8 & 10)

V

SD

0.85

0.95

V

V

GS

= 0V, I

S

= 3.2A, T

J

= +25°C

DYNAMIC CHARACTERISTICS (Note 10)
Input Capacitance

C

iss

303

pF

V

DS

= 15V, V

GS

= 0V,

f = 1MHz

Output Capacitance

C

oss

59

Reverse Transfer Capacitance

C

rss

30

Total Gate Charge (Note 9)

Q

g

3.0

nC

V

DS

= 10V, V

GS

= 10V,

I

D

= 4A

Gate-Source Charge (Note 9)

Q

gs

0.8

Gate-Drain Charge (Note 9)

Q

gd

1.0

Turn-On Delay Time (Note 9)

t

D(on)

2.49

ns

V

DD

= 10V , I

D

=4A,

R

G

= 6Ω, V

GS

= 5V

Turn-On Rise Time (Note 9)

t

r

5.21

Turn-Off Delay Time (Note 9)

t

D(off)



7.47



Turn-Off Fall Time (Note 9)

t

f



4.62



Reverse Recovery Time

t

rr



23



ns

T

J

= +25°C, I

F

= 4A,

di/dt= 100A/

µ

s

Reverse Recovery Charge

Qrr



5.65



nC

Notes:

8. Measured under pulsed conditions. Width=300μs. Duty cycle

2%.

9. Switching characteristics are independent of operating junction temperature.

10. Guaranteed by design. Not subject to production testing.














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