Package outline dimensions, Suggested pad layout – Diodes ZXMP6A17N8 User Manual
Page 7
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ZXMP6A17N8
Document Number DS32076 Rev 1 - 2
7 of 8
March 2010
© Diodes Incorporated
A Product Line of
Diodes Incorporated
ZXMP6A17N8
ADVAN
CE I
N
F
O
RM
ATI
O
N
Package Outline Dimensions
θ
DIM Inches Millimeters
DIM Inches Millimeters
Min. Max. Min. Max.
Min. Max. Min.
Max.
A
0.053
0.069
1.35
1.75
e
0.050 BSC
1.27 BSC
A1 0.004 0.010 0.10 0.25
b
0.013 0.020 0.33
0.51
D 0.189 0.197 4.80 5.00
c
0.008 0.010 0.19
0.25
H 0.228
0.244
5.80 6.20 θ
0° 8° 0°
8°
E 0.150 0.157 3.80 4.00
h
0.010 0.020 0.25
0.50
L
0.016
0.050
0.40
1.27
- - - -
-
Suggested Pad Layout
1.52
0.060
7.0
0.275
0.6
0.024
1.27
0.050
4.0
0.155
mm
inches
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