Package outline dimensions, Suggested pad layout – Diodes ZXMP6A17N8 User Manual

Page 7

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ZXMP6A17N8

Document Number DS32076 Rev 1 - 2

7 of 8

www.diodes.com

March 2010

© Diodes Incorporated

A Product Line of

Diodes Incorporated

ZXMP6A17N8

ADVAN

CE I

N

F

O

RM

ATI

O

N







Package Outline Dimensions


θ


DIM Inches Millimeters

DIM Inches Millimeters

Min. Max. Min. Max.

Min. Max. Min.

Max.

A

0.053

0.069

1.35

1.75

e

0.050 BSC

1.27 BSC

A1 0.004 0.010 0.10 0.25

b

0.013 0.020 0.33

0.51

D 0.189 0.197 4.80 5.00

c

0.008 0.010 0.19

0.25

H 0.228

0.244

5.80 6.20 θ

0° 8° 0°

E 0.150 0.157 3.80 4.00

h

0.010 0.020 0.25

0.50

L

0.016

0.050

0.40

1.27

- - - -

-



Suggested Pad Layout


1.52

0.060

7.0

0.275

0.6

0.024

1.27

0.050

4.0

0.155

mm

inches



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