Maximum ratings, Thermal characteristics, Electrical characteristics – Diodes ZXMP10A17E6Q User Manual

Page 2

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ZXMP10A17E6Q

Document Number DS36689 Rev. 2 - 2

2 of 7

www.diodes.com

December 2013

© Diodes Incorporated

ZXMP10A17E6Q

ADVAN

CE I

N

F

O

RM

ATI

O

N



Maximum Ratings

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value Unit

Drain-Source Voltage

V

DSS

-100 V

Gate-Source Voltage

V

GS

20

V

Continuous Drain Current

V

GS

= 10V

(Note 7)

I

D

-1.6

A

T

A

= +70°C (Note 7)

-1.3

(Note 6)

-1.3

Pulsed Drain Current

V

GS

= 10V

(Note 8)

I

DM

-7.7 A

Continuous Source Current (Body diode)

(Note 7)

I

S

-2.1 A

Pulsed Source Current (Body diode)

(Note 8)

I

SM

-7.7 A


Thermal Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value Unit

Power dissipation
Linear derating factor

(Note 6)

P

D

1.1
8.8

W

mW/°C

(Note 7)

1.7

13.7

Thermal Resistance, Junction to Ambient

(Note 6)

R

θJA

113

°C/W

(Note 7)

73

Operating and Storage Temperature Range

T

J

, T

STG

-55 to +150

°C


Electrical Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Min

Typ

Max

Unit

Test

Condition

OFF CHARACTERISTICS
Drain-Source Breakdown Voltage

BV

DSS

-100

V

I

D

= -250µA, V

GS

= 0V

Zero Gate Voltage Drain Current

I

DSS

-0.5 µA

V

DS

= -100V, V

GS

= 0V

Gate-Source Leakage

I

GSS

100

nA

V

GS

=

20V, V

DS

= 0V

ON CHARACTERISTICS
Gate Threshold Voltage

V

GS(th)

-2.0

-4.0 V

I

D

= -250µA, V

DS

= V

GS

Static Drain-Source On-Resistance (Note 9)

R

DS(ON)

0.350

V

GS

= -10V, I

D

= -1.4A

0.450

V

GS

= -6V, I

D

= -1.2A

Forward Transconductance (Notes 9 & 10)

g

fs

2.8

S

V

DS

= -15V, I

D

= -1.4A

Diode Forward Voltage (Note 9)

V

SD

-0.85 -0.95 V I

S

= -1.7A, V

GS

= 0V

Reverse recovery time (Note 10)

t

rr

33

ns

I

S

= -1.5A, di/dt = 100A/µs

Reverse recovery charge (Note 10)

Q

rr

48

nC

DYNAMIC CHARACTERISTICS (Note 10)
Input Capacitance

C

iss

424

pF

V

DS

= -50V, V

GS

= 0V

F = 1MHz

Output Capacitance

C

oss

36.6

pF

Reverse Transfer Capacitance

C

rss

29.8

pF

Total Gate Charge (Note 11)

Q

g



7.1



nC

V

GS

= -6V

V

DS

= -50V

I

D

= -1.4A

Total Gate Charge (Note 11)

Q

g

10.7

nC

V

GS

= -10V

Gate-Source Charge (Note 11)

Q

gs

1.7

nC

Gate-Drain Charge (Note 11)

Q

gd

3.8

nC

Turn-On Delay Time (Note 11)

t

D(on)

3

ns

V

DD

= -50V, V

GS

= -10V

I

D

= -1A, R

G

 6.0Ω

Turn-On Rise Time (Note 11)

t

r

3.5

ns

Turn-Off Delay Time (Note 11)

t

D(off)

13.4

ns

Turn-Off Fall Time (Note 11)

t

f

7.2

ns

Notes:

6. For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is measured

when operating in a steady-state condition.

7. Same as note (6), except the device is measured at t

 5 sec.

8. Same as note (6), except the device is pulsed with D = 0.05 and pulse width 10µs. The pulse current is limited by the maximum junction temperature.

9. Measured under pulsed conditions. Pulse width

 300µs; duty cycle  2%.

10. For design aid only, not subject to production testing.

11. Switching characteristics are independent of operating junction temperatures.


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