Diodes SM05 User Manual

Sm05 new prod uc t, Features, Mechanical data

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SM05

Document number: DS31828 Rev. 4 - 2

1 of 4

www.diodes.com

April 2010

© Diodes Incorporated

SM05

NEW PROD

UC

T


DUAL SURFACE MOUNT TVS

Features

300 Watts Peak Pulse Power (tp = 8x20

μs)

IEC 61000-4-2 (ESD): Air – 15kV, Contact – 8kV

Dual Common Anode TVS

SOT-23 Package Allows Either Two Separate Unidirectional
Configurations or a Single Bidirectional Configuration

Lead Free/RoHS Compliant (Note 3)

“Green” Device (Note 4)

Qualified to AEC-Q101 Standards for High Reliability

Mechanical Data

• Case:

SOT-23

Case Material: Molded Plastic, “Green” Molding Compound,
Note 3. UL Flammability Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020

Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating) Solderable per MIL-STD-202, Method 208

Ordering Information: See Page 2

Marking Information: See Page 2

Weight: 0.0089 grams (approximate)












Thermal Characteristics

Characteristic Symbol

Value

Unit

Peak Pulse Power (tp = 8x20

μs) (Note 6) T

A

= 25°C

P

pk

300 W

Thermal Resistance, Junction to Ambient (Note 6) T

A

= 25°C

R

θJA

417

°C/W

Operating and Storage Temperature Range

T

J

, T

STG

-55 to +150

°C




Electrical Characteristics

@T

A

= 25°C unless otherwise specified (Note 7)

Reverse

Standoff

Voltage

Breakdown

Voltage

V

BR

@ I

T

Test

Current

Max. Reverse

Leakage @ V

RWM

(Note 5)

Max. Clamping

Voltage @ I

PP

= 5A

(Note 2)

Max. Clamping Voltage

V

C

@ I

PP

(Note 2)

Typical

Capacitance C

T

(Note 1)

V

RWM

(V) Min (V) Max (V)

I

T

(mA)

I

R

(

μA) V

C

(V)

V

C

(V)

I

PP

(A) (pF)

5 6.2

7.3

1.0

10

9.8

20.6

17

230

Notes: 1.

V

R

= 0V, f = 1MHz.

2. Clamping voltage value is based on an 8x20

μs peak pulse current (I

pp

) waveform.

3. No purposefully added lead.
4. Diodes Inc.’s “Green” policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Short duration pulse test used to minimize self-heating effect.
6. Device mounted on FR-4 PC board with suggested pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
Measured across pin 1 and pin 2.

















Top View

Device Schematic

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