Diodes ZXLD1366 - Manual (Page 24)

ZXLD1366
Document number: DS31992 Rev. 8 - 2
24 of 30
www.diodes.com
October 2013
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A Product Line of
Diodes Incorporated
ZXLD1366
Application Information
(cont.)
Thermal Considerations
When operating the device at high ambient temperatures, or when driving maximum load current, care must be taken to avoid exceeding the
package power dissipation limits. The graph below gives details for power derating. This assumes the device to be mounted on a 25mm
2
PCB with 1oz copper standing in still air.
Note that the device power dissipation will most often be a maximum at minimum supply voltage. It will also increase if the efficiency of the
circuit is low. This may result from the use of unsuitable coils, or excessive parasitic output capacitance on the switch output.
In order to maximize the thermal capabilities of the DFN3030-6 and the SO-8EP packages thermal vias should be incorporated into the PCB.
See figures 7 and 8 for examples used in the ZXLD1366 evaluation boards.
Figure 7 Suggested Layout for U-DFN3030-6 Package
-40 -25 -10 5 20 35 50 65 80 -5 110 125
AMBIENT TEMPERATURE (°C)
Maximum Power Dissipation
PO
W
E
R DI
SSI
P
A
T
IO
N
(W
)
2.5
2.0
1.5
1.0
0.5
0
SO-8EP
U-DFN3030-6
TSOT25