Diodes 1N5711W - Manual

1N5711W
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Features
•
Low Forward Voltage Drop
• Guard Ring Construction for Transient Protection
•
Fast Switching Time
•
Low Reverse Capacitance
• Surface Mount Package Ideally Suited for Automated Insertion
• Lead, Halogen and Antimony Free, RoHS Compliant
"Green" Device (Notes 3 and 4)
Mechanical Data
•
Case: SOD-123
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
•
Terminals: Solderable per MIL-STD-202, Method 208
•
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe)
•
Polarity: Cathode Band
•
Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.01 grams (approximate)
Top View
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage V
RRM
V RWM
V R
70 V
RMS Reverse Voltage V
R(RMS)
49 V
Maximum Forward Current I
FM
15 mA
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 1) P
D
333 mW
Thermal Resistance, Junction to Ambient Air (Note 1) R θJA 300 °C/W
Operating Temperature Range T
J
-55 to +125
°C
Storage Temperature Range T
STG
-55 to +150 °C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 2) V
(BR)R
70 ⎯ ⎯ V I
R
= 10 μA
Forward Voltage Drop V
F
⎯ ⎯
0.41
1.00
V
I
F
= 1.0mA
I
F
= 15mA
Reverse Leakage Current (Note 2) I
R
⎯ ⎯ 200 nA V
R
= 50V
Total Capacitance C
T
⎯ ⎯ 2.0 pF V
R
= 0V, f = 1.0MHz
Reverse Recovery Time t
rr
⎯ ⎯ 1.0 ns
I
F
= I
R
= 5.0mA
I
rr
= 0.1 x I
R
, R
L
= 100
Ω
Notes: 1. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead. Halogen and Antimony Free.
4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code
V9 are built with Non-Green Molding Compound and may contain Halogens or Sb
2
O
3
Fire Retardants.
1N5711W
Document number: DS11015 Rev. 14 - 2
1 of 3
www.diodes.com
July 2008
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