Diodes BAS70JW - Manual

BAS70JW
Document number: DS30188 Rev. 13 - 2
1 of 3
www.diodes.com
June 2008
© Diodes Incorporated
BAS70JW
SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAY
Features
•
Low Forward Voltage Drop
• Fast Switching
•
Ultra-Small Surface Mount Package
•
PN Junction Guard Ring for Transient and ESD Protection
• Lead Free/RoHS Compliant (Note 3)
• "Green" Device (Note 4 and 5)
Mechanical Data
•
Case: SOT-363
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
•
Terminals: Solderable per MIL-STD-202, Method 208
•
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe). Please see Ordering Information, Note 7, on Page 2
•
Orientation: See Diagram
•
Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.006 grams (approximate)
C
1
A
2
A
1
C
2
Top View Device Schematic
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage V
RRM
V
RWM
V
R
70 V
RMS Reverse Voltage V
R(RMS)
49 V
Forward Continuous Current (Note 1) I FM
70 mA
Non-Repetitive Peak Forward Surge Current @ t < 1.0s I
FSM
100 mA
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 1) P
D
200 mW
Thermal Resistance Junction to Ambient Air (Note 1) R θJA 625 °C/W
Operating Temperature Range T
J
-55 to +125 °C
Storage Temperature Range T STG
-65 to +125 °C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic Symbol Min Max Unit Test Condition
Reverse Breakdown Voltage (Note 2) V
(BR)R
70 ⎯ V I
R
= 10
μA
Forward Voltage V
F
⎯ 410
1000
mV
mV t
p
<300µs , I
F
= 1.0mA
t
p
<300µs , I
F
= 15mA
Reverse Current (Note 2) I
R
⎯ 100 nA t
p
< 300µs , V
R
= 50V
Total Capacitance C
T
⎯ 2.0 pF V
R
= 0V , f = 1.0MHz
Reverse Recovery Time t
rr
⎯ 5.0 ns
I
F
= I
R
= 10mA to I
R
= 1.0mA,
I
rr
= 0.1 x I
R
, R
L
= 100
Ω
Notes: 1. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
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