Diodes BAV199DW User Manual
Features, Mechanical data, Maximum ratings
BAV199DW
Document number: DS30417 Rev. 9 - 2
1 of 4
www.diodes.com
August 2009
© Diodes Incorporated
BAV199DW
Features
•
Surface Mount Package Ideally Suited for Automated Insertion
•
Very Low Leakage Current
•
Lead Free/RoHS Compliant (Note 3)
•
"Green" Device (Notes 4 and 5)
•
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
• Case:
SOT-363
•
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
•
Moisture Sensitivity: Level 1 per J-STD-020
•
Terminals: Finish - Matte Tin annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
•
Polarity: See Diagram
•
Marking Information: See Page 2
•
Ordering Information: See Page 2
•
Weight: 0.008 grams (approximate)
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
R
85
V
RMS Reverse Voltage
V
R(RMS)
60
V
Forward Continuous Current (Note 2)
Single diode
Double
diode
I
FM
160
140
mA
Repetitive Peak Forward Current (Note 2)
I
FRM
500
mA
Non-Repetitive Peak Forward Surge Current
@ t = 1.0
μs
@ t = 1.0ms
@ t = 1.0s
I
FSM
4.0
1.0
0.5
A
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 2)
P
D
200
mW
Thermal Resistance Junction to Ambient Air (Note 2)
R
θJA
625
°C/W
Operating and Storage Temperature Range
T
J
, T
STG
-65 to +150
°C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 1)
V
(BR)R
85
⎯
⎯
V
I
R
= 100
μA
Forward Voltage
V
F
⎯
⎯
0.90
1.0
1.1
1.25
V
I
F
= 1.0mA
I
F
= 10mA
I
F
= 50mA
I
F
= 150mA
Leakage Current (Note 1)
I
R
⎯
⎯
5.0
80
nA
nA
V
R
= 75V
V
R
= 75V, T
J
= 150
°C
Total Capacitance
C
T
⎯
2
⎯
pF
V
R
= 0, f = 1.0MHz
Reverse Recovery Time
t
rr
⎯
⎯
3.0
μs
I
F
= I
R
= 10mA,
I
rr
= 0.1 x I
R
, R
L
= 100
Ω
Notes:
1. Short duration pulse test used to minimize self-heating effect.
2. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our websit5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb
2
O
3
Fire Retardants.
TOP VIEW
SOT-363
Internal Schematic
TOP VIEW
AC
1
AC
2
C
2
A
1
A
2
C
1