Diodes BAV199DW User Manual

Features, Mechanical data, Maximum ratings

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BAV199DW

Document number: DS30417 Rev. 9 - 2

1 of 4

www.diodes.com

August 2009

© Diodes Incorporated

BAV199DW

QUAD SURFACE MOUNT LOW LEAKAGE DIODE

Features

Surface Mount Package Ideally Suited for Automated Insertion

Very Low Leakage Current

Lead Free/RoHS Compliant (Note 3)

"Green" Device (Notes 4 and 5)

Qualified to AEC-Q101 Standards for High Reliability

Mechanical Data

• Case:

SOT-363

Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020

Terminals: Finish - Matte Tin annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208

Polarity: See Diagram

Marking Information: See Page 2

Ordering Information: See Page 2

Weight: 0.008 grams (approximate)

Maximum Ratings

@T

A

= 25°C unless otherwise specified

Characteristic

Symbol

Value

Unit

Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage

V

RRM

V

RWM

V

R

85

V

RMS Reverse Voltage

V

R(RMS)

60

V

Forward Continuous Current (Note 2)

Single diode

Double

diode

I

FM

160
140

mA

Repetitive Peak Forward Current (Note 2)

I

FRM

500

mA

Non-Repetitive Peak Forward Surge Current

@ t = 1.0

μs

@ t = 1.0ms

@ t = 1.0s

I

FSM

4.0
1.0
0.5

A

Thermal Characteristics

Characteristic

Symbol

Value

Unit

Power Dissipation (Note 2)

P

D

200

mW

Thermal Resistance Junction to Ambient Air (Note 2)

R

θJA

625

°C/W

Operating and Storage Temperature Range

T

J

, T

STG

-65 to +150

°C

Electrical Characteristics

@T

A

= 25°C unless otherwise specified

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

Reverse Breakdown Voltage (Note 1)

V

(BR)R

85

V

I

R

= 100

μA

Forward Voltage

V

F

0.90

1.0
1.1

1.25

V

I

F

= 1.0mA

I

F

= 10mA

I

F

= 50mA

I

F

= 150mA

Leakage Current (Note 1)

I

R

5.0

80

nA
nA

V

R

= 75V

V

R

= 75V, T

J

= 150

°C

Total Capacitance

C

T

2

pF

V

R

= 0, f = 1.0MHz

Reverse Recovery Time

t

rr

3.0

μs

I

F

= I

R

= 10mA,

I

rr

= 0.1 x I

R

, R

L

= 100

Ω

Notes:

1. Short duration pulse test used to minimize self-heating effect.
2. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date

Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb

2

O

3

Fire Retardants.


TOP VIEW

SOT-363

Internal Schematic

TOP VIEW

AC

1

AC

2

C

2

A

1

A

2

C

1

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