Diodes BAW567DW - Manual

BAW567DW
QUAD SURFACE MOUNT SWITCHING DIODE ARRAY
Features
•
Fast Switching Speed
• Ultra-Small Surface Mount Package
•
For General Purpose Switching Applications
•
High Conductance
•
One BAV70 Circuit and One BAW56 Circuit In One Package
• Lead Free/RoHS Compliant (Note 3)
•
Qualified to AEC-Q101 Standards for High Reliability
•
"Green" Device (Notes 4 and 5)
Mechanical Data
•
Case: SOT-363
• Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
•
Moisture Sensitivity: Level 1 per J-STD-020D
•
Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed
over Alloy 42 leadframe).
• Polarity: See Diagram
•
Marking Information: See Page 2
•
Ordering Information: See Page 2
• Weight: 0.006 grams (approximate)
SOT-363
C 1
A
2
C
2
A 1
C 2
A 1
Internal Schematic
TOP VIEW
TOP VIEW
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Unit
Non-Repetitive Peak Reverse Voltage V
RM
100 V
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage V RRM
V
RWM
V
R
75 V
RMS Reverse Voltage V
R(RMS)
53 V
Forward Continuous Current (Note 1) I FM
300 mA
Average Rectified Output Current (Note 1) I
O
150 mA
Non-Repetitive Peak Forward Surge Current @ t = 1.0
μs
@ t = 1.0s
I
FSM
2.0
1.0
A
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 1) P D
200 mW
Thermal Resistance Junction to Ambient Air (Note 1) R θJA 625 °C/W
Operating and Storage Temperature Range T
J
, T
STG
-65 to +150 °C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic Symbol Min Max Unit Test Condition
Reverse Breakdown Voltage (Note 2) V
(BR)R
75 ⎯ V I
R
= 2.5
μA
Forward Voltage V
F
⎯
0.715
0.855
1.0
1.25
V
I
F
= 1.0mA
I
F
= 10mA
I
F
= 50mA
I
F
= 150mA
Reverse Current (Note 2) I
R
⎯
2.5
50
30
25
μA
μA
μA
nA V
R
= 75V
V
R
= 75V, T
J
= 150 °C
V R = 25V, T J = 150
°C
V R = 20V
Total Capacitance C T
⎯ 2.0 pF V R = 0, f = 1.0MHz
Reverse Recovery Time t
rr
⎯ 4.0 ns
I
F
= I
R
= 10mA,
I rr = 0.1 x I R , R L = 100
Ω
Notes: 1. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
BAW567DW
Document number: DS30147 Rev. 10 - 2
1 of 3
www.diodes.com
February 2008
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