Package outline dimensions, Suggested pad layout – Diodes 2DB1697 User Manual
Page 4
2DB1697
Document number: DS31618 Rev. 3 - 2
4 of 5
April 2012
© Diodes Incorporated
2DB1697
NEW PROD
UC
T
0.1
1
10
100
V , REVERSE VOLTAGE (V)
R
Fig. 7 Typical Capacitance Characteristics
10
100
1,000
C
A
P
A
C
IT
AN
C
E (
p
F
)
C
ibo
C
obo
f = 1MHz
V
= -2V
f = 100MHz
CE
0
10
20
30
40
50
60
70
80
90 100
-I , COLLECTOR CURRENT (mA)
C
Fig. 8 Typical Gain-Bandwidth Product
vs. Collector Current
1
10
100
1,000
f,
G
AI
N
-B
A
N
DW
ID
T
H
P
R
O
D
U
C
T
(M
H
z)
T
V
= -2V
f = 100MHz
CE
Package Outline Dimensions
Suggested Pad Layout
SOT89
Dim Min Max
A 1.40 1.60
B 0.44 0.62
B1 0.35 0.54
C 0.35 0.43
D 4.40 4.60
D1
1.52 1.83
E 2.29 2.60
e 1.50
Typ
e1 3.00
Typ
H 3.94 4.25
L 0.89 1.20
All Dimensions in mm
Dimensions Value (in mm)
X
0.900
X1
1.733
X2
0.416
Y
1.300
Y1
4.600
Y2
1.475
Y3
0.950
Y4
1.125
C
1.500
e
D
H
L
A
C
E
8° (4
X)
B1
B
D1
R
0.
20
0
e1
Y1
X1
Y2
Y
C
X (3x)
Y3
Y4
X2 (2x)