Diodes DDC (LO-R1) H User Manual
Ddc (lo-r1) h, Nxxym, Features
DDC (LO-R1) H
NPN PRE-BIASED SMALL SIGNAL DUAL SURFACE MOUNT TRANSISTOR
Features
•
Epitaxial Planar Die Construction
•
Complementary PNP Types Available (DDA)
•
Built-In Biasing Resistors
•
Lead Free By Design/RoHS Compliant (Note 3)
•
"Green" Device (Note 4 and 5)
Mechanical Data
DS30428 Rev. 4 - 2
1 of 3
www.diodes.com
DDC (LO-R1) H
© Diodes Incorporated
•
Case: SOT-563, Molded Plastic
•
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
•
Moisture Sensitivity: Level 1 per J-STD-020C
•
Terminals: Finish - Matte Tin annealed over Alloy 42
leadframe. Solderable per MIL-STD-202, Method 208
•
Terminal Connections: See Diagram
•
Weight: 0.005 grams (approximate)
P/N
R1 (NOM) R2 (NOM) MARKING
DDC122LH
DDC142JH
DDC122TH
DDC142TH
0.22K
Ω
0.47K
Ω
0.22K
Ω
0.47K
Ω
10K
Ω
10K
Ω
OPEN
OPEN
N81
N82
N83
N84
SOT-563
Dim
Min Max Typ
A
0.15
0.30 0.25
B
1.10
1.25 1.20
C
1.55
1.70 1.60
D
0.50
G
0.90
1.10 1.00
H
1.50
1.70 1.60
K
0.56
0.60 0.60
L
0.15
0.25 0.20
M
0.10
0.18 0.11
All Dimensions in mm
A
M
L
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Supply Voltage (6) to (1) and (3) to (4)
V
CC
50
V
Input Voltage (2) to (1) and (5) to (4)
DDC122LH
DDC142JH
V
IN
-5 to +6
-5 to +6
V
Input Voltage (1) to (2) and (4) to (5)
DDC122TH
DDC142TH
V
EBO (MAX)
5
V
Output Current All
I
C
100
mA
Power Dissipation
P
d
150
mW
Thermal Resistance, Junction to Ambient Air (Note 2)
R
θJA
833
°C/W
Notes:
1. Package is non-polarized. Parts may be on reel in orientation illustrated, 180° rotated, or mixed (both ways).
2. Mounted on FR4 Board with recommended pad layout at http://www.diodes.com/datasheets/ap02001.pdf.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants
R
1
, R
2
R
1
Only
SCHEMATIC DIAGRAM, TOP VIEW
R
1
6
5
4
3
2
1
R
1
R
1
R
1
R
2
6
5
4
3
2
1
R
2
B C
H
K
G
D
NXXYM
SEE NOTE 1