Maximum ratings, Thermal characteristics, Electrical characteristics – Diodes 2N7002K User Manual

Page 2

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2N7002K

Document number: DS30896 Rev. 14 - 2

2 of 6

www.diodes.com

August 2013

© Diodes Incorporated

2N7002K

NEW PROD

UC

T


Maximum Ratings

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Units

Drain-Source Voltage

V

DSS

60 V

Gate-Source Voltage

V

GSS

±20 V

Continuous Drain Current (Note 6) V

GS

= 10V

Steady

State

T

A

= +25°C

T

A

= +70°C

I

D

380
300

mA

t<5s

T

A

= +25°C

T

A

= +70°C

I

D

430
340

mA

Continuous Drain Current (Note 6) V

GS

= 5V

Steady

State

T

A

= +25°C

T

A

= +70°C

I

D

310
240

mA

t<5s

T

A

= +25°C

T

A

= +70°C

I

D

350
270

mA

Maximum Continuous Body Diode Forward Current (Note 6)

I

S

0.5 A

Pulsed Drain Current (10µs pulse, duty cycle = 1%) (Note 6)

I

DM

1.2 A


Thermal Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Units

Total Power Dissipation (Note 5)

P

D

370 mW

Thermal Resistance, Junction to Ambient (Note 5)

Steady State

R

θJA

357

°C/W

t<5s 292

Total Power Dissipation (Note 6)

P

D

540 mW

Thermal Resistance, Junction to Ambient (Note 6)

Steady State

R

θJA

240

°C/W

t<5s 197

Thermal Resistance, Junction to Case (Note 6 )

R

θJC

91

Operating and Storage Temperature Range

T

J,

T

STG

-55 to +150

°C


Electrical Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Min

Typ

Max

Unit

Test

Condition

OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage

BV

DSS

60

— V

V

GS

= 0V, I

D

= 10µA

Zero Gate Voltage Drain Current

I

DSS

— — 1.0 µA

V

DS

= 60V, V

GS

= 0V

Gate-Source Leakage

I

GSS

— — ±10 µA

V

GS

= ±20V, V

DS

= 0V

ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage

V

GS(th)

1.0 1.6 2.5 V V

DS

= 10V, I

D

= 1mA

Static Drain-Source On-Resistance

R

DS(ON)


2.0
3.0

V

GS

= 10V, I

D

= 0.5A

V

GS

= 5V, I

D

= 0.05A

Forward Transfer Admittance

|Y

fs

|

80

— ms

V

DS

=10V, I

D

= 0.2A

Diode Forward Voltage

V

SD

— 0.75 1.1 V V

GS

= 0V, I

S

= 115mA

DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance

C

iss

30 50 pF

V

DS

= 25V, V

GS

= 0V

f = 1.0MHz

Output Capacitance

C

oss

4.2 25 pF

Reverse Transfer Capacitance

C

rss

2.9 5.0 pF

Gate Resistance

R

g

133 —

f = 1MHz , V

GS

= 0V, V

DS

= 0V

Total Gate Charge

Q

g

0.3

nC

V

GS

= 4.5V, V

DS

= 10V,

I

D

= 250mA

Gate-Source Charge

Q

gs

0.2

nC

Gate-Drain Charge

Q

gd

0.08

nC

Turn-On Delay Time

t

D(on)

3.9

ns

V

DD

= 30V, V

GS

= 10V,

R

G

= 25

Ω, I

D

= 200mA

Turn-On Rise Time

t

r

3.4

ns

Turn-Off Delay Time

t

D(off)

15.7

ns

Turn-Off Fall Time

t

f

9.9

ns

Notes:

5. Device mounted on FR-4 PCB, with minimum recommended pad layout
6. Device mounted on 1” x 1” FR-4 PCB with high coverage 2oz. Copper, single sided.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.







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