Bss84v new prod uc t, Maximum ratings, Thermal characteristics – Diodes BSS84V User Manual

Page 2: Electrical characteristics, Bss84v

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BSS84V

Document number: DS30605 Rev. 9 - 2

2 of 5

www.diodes.com

February 2013

© Diodes Incorporated

BSS84V

NEW PROD

UC

T





Maximum Ratings

(@T

A

= +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Units

Drain-Source Voltage

V

DSS

-50

V

Drain-Gate Voltage (Note 5)

V

DGR

-50

V

Gate-Source Voltage

Continuous

V

GSS

20

V

Drain Current (Note 6)

Continuous

I

D

-130

mA



Thermal Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Units

Total Power Dissipation

P

D

150

mW

Thermal Resistance, Junction to Ambient

R

θJA

833

C/W

Operating and Storage Temperature Range

T

j

, T

STG

-55 to +150

C



Electrical Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage

BV

DSS

-50

-75

V

V

GS

= 0V, I

D

= -250µA


Zero Gate Voltage Drain Current

I

DSS






-1
-2

-100

µA
µA

nA

V

DS

= -50V, V

GS

= 0V, T

J

= +25

C

V

DS

= -50V, V

GS

= 0V, T

J

= +125

C

V

DS

= -25V, V

GS

= 0V, T

J

= +25

C

Gate-Body Leakage

I

GSS

50

nA

V

GS

=

20V, V

DS

= 0V

ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage

V

GS(th)

-0.8

-1.6

-2.0

V

V

DS

= V

GS

, I

D

= -1mA

Static Drain-Source On-Resistance

R

DS (ON)

2

10

V

GS

= -5V, I

D

= -0.100A

Forward Transconductance

g

FS

0.05

S

V

DS

= -25V, I

D

= -0.1A

DYNAMIC CHARACTERISTICS
Input Capacitance

C

iss

45

pF


V

DS

= -25V, V

GS

= 0V, f = 1.0MHz

Output Capacitance

C

oss

25

pF

Reverse Transfer Capacitance

C

rss

12

pF

SWITCHING CHARACTERISTICS
Turn-On Delay Time

t

D(ON)

10

ns

V

DD

= -30V, I

D

= -0.27A,

R

GEN

= 50

, V

GS

= -10V

Turn-Off Delay Time

t

D(OFF)

18

ns

Notes:

5. R

GS

 20K.

6. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which

can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.

7. Short duration pulse test used to minimize self-heating effect.





















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