Data sheet, Application information (continued), F_adj : r – Diodes AUR9716 User Manual

Page 12: Selection, Thermal characteristics, Pc board layout considerations

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Data Sheet

1.0MHz to 1.4MHz, 2A, STEP DOWN DC-DC CONVERTER AUR9716

Apr. 2012 Rev. 1. 0 BCD Semiconductor Manufacturing Limited

12

Application Information (Continued)

Figure 25. SCP Protection


7. F_ADJ : R

OSC

Selection

The AUR9716 can change switching frequency by
choose different R

OSC

, please refer to Table 2.

Switching Frequency

(MHz)

1.4 1.2 1.0

R

OSC

(kΩ) 5100

976

536

Table 2. R

OSC

Setting


Due to get the better performance of AUR9716,
F_ADJ pin (Pin 7)could parallel 47pF capacitor
with R

OSC

, shown in Figure 26.

Figure 26. F_ADJ Components


8. Thermal Characteristics

The max power dissipation depends on the thermal
resistance of IC package, PCB layout, the rate of
temperature between junction to ambient. The max
power dissipation can be calculated by following
formula:

⎟⎟

⎜⎜

=

JA

A

MAX

J

MAX

D

T

T

P

θ

)

(

)

(

Where T

J(max)

is the maximum operation junction

temperature, T

A

is the ambient temperature and θ

JA

is

the junction to ambient thermal resistance.

9. PC Board Layout Considerations

When laying out the printed circuit board, the
following checklist should be used to optimize the
performance of AUR9716.

1. The power traces, including the GND trace, the SW
trace and the

VDD trace should be kept direct, short

and wide.

2. To put the input capacitor as close as possible to the

VDD

and GND pins.

3. The FB pin should be connected directly to the

feedback resistor divider.

4. Keep the switching node, SW, away from the
sensitive FB pin and the node should be kept small
area.










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