Diodes AP7362 - Manual (Page 10)

AP7362
Document number: DS35058 Rev. 6 - 2
10 of 15
www.diodes.com
August 2013
© Diodes Incorporated
AP7362
Application Information
(cont.)
Short Circuit Protection
When output current at OUT pin is higher than current limit threshold, the current limit protection will be triggered and clamp the output current to
prevent over-current and to protect the regulator from damage due to overheating.
Thermal Shutdown Protection
Thermal protection disables the output when the junction temperature rises to approximately +170°C, allowing the device to cool down. When
the junction temperature reduces to approximately +160°C the output circuitry is enabled again. Depending on power dissipation, thermal
resistance, and ambient temperature, the thermal protection circuit may cycle on and off. This cycling limits
the heat dissipation of the regulator, protecting it from damage due to overheating.
Low Quiescent Current
The AP7362, consumes only around 0.5mA for all input voltage range and load currents, this provides great power saving in portable and low
power applications.
Output Noise
This is the integrated value of the output noise over a specified frequency range. Input voltage and output load current are kept constant during
the measurement. Results are expressed in μVrms or μV √Hz.
The AP7362 is a low noise regulator and needs no external noise reduction capacitor. Output voltage noise is typically 100μVrms overall noise
level between 100 Hz and 100 kHz
Noise is specified in two ways:
Output noise density is the RMS sum of all noise sources, measured at the regulator output, at a specific frequency (measured with a 1Hz
bandwidth). This type of noise is usually plotted on a curve as a function of frequency.
Output noise voltage is the RMS sum of spot noise over a specified bandwidth. Spot noise is measured in units μV/√Hz or nV/√Hz and total
output noise is measured in μV(RMS). The primary source of noise in low-dropout regulators is the internal reference.
Power Dissipation
The device power dissipation and proper sizing of the thermal plane that is connected to the thermal pad is critical to avoid thermal shutdown and
ensure reliable operation. Power dissipation of the device depends on input voltage and load conditions and can be calculated by:
P
D
= (V
IN
- V
OUT
) X I
OUT
The maximum power dissipation, handled by the device, depends on the junction to ambient thermal resistance, and maximum ambient
temperature, which can be calculated by the equation in the following:
JA
R
)
A
T - C 150 (
P
MAX _ D

 
