Diodes AL8807A - Manual (Page 4)

AL8807A
Document number: DS35990 Rev. 2 - 2
4 of 20
www.diodes.com
March 2013
© Diodes Incorporated
AL8807A
Electrical Characteristics
(@T A = +25°C, unless otherwise specified.)
Symbol Parameter Conditions Min Typ Max Unit
V
INSU Internal Regulator Start Up Threshold V
IN
rising 5.9 V
V
INSH Internal Regulator Hysteresis Threshold V IN
falling 100 300 mV
I
Q Quiescent Current CTRL pin
floating
Output not switching (Note 6) 350 µA
I
S Input Supply Current f = 250kHz 1.8 5 mA
V
TH Set Current Threshold Voltage
CTRL pin floating
95 100 105 mV
V
TH-H Set Threshold Hysteresis ±20 %
V
TH-10% 10% Set Current Threshold Voltage V
CTRL
= 0.25V 4 10 15 mV
I
SET SET Pin Input Current V
SET
= V
IN
-0.1 16 22 µA
R
CTRL CTRL Pin Input Resistance Referred to internal reference 50 k Ω
V
REF Internal Reference Voltage 2.5 V
R
DS(on)
On Resistance of SW MOSFET I
SW
= 0.3A
SOT25 0.25 0.40
Ω
MSOP-8EP 0.18 0.35
t
R SW Rise Time V SENSE = 100 ±20mV, f SW = 250kHz
V
SW
= 0.1V ~ 12V ~ 0.1V, C
L
= 15pF
12 ns
t
F SW Fall Time 20 ns
I
SW_Leakage
Switch Leakage Current V
IN
= 36V 0.5 μA
T
OTP Over-Temperature Shutdown 150
C
T
OTP-Hyst Over-Temperature Hysteresis 25
C

JA
Thermal Resistance Junction-to-Ambient
(Note 7)
SOT25 (Note 8) 250
°C/W
MSOP-8EP (Note 9) 69

JL
Thermal Resistance Junction-to-Lead
(Note 10)
SOT25 (Note 8) 50

JC
Thermal Resistance Junction-to-case
(Note 11)
MSOP-8EP (Note 9) 4.3
Notes: 6. AL8807A does not have a low power standby mode but current consumption is reduced when output is not being switched.
7. Refer to Figure 40 for the device derating curve.
8. Test condition for SOT25: Device mounted on FR-4 PCB (25mm x 25mm 1oz copper, minimum recommended pad layout on top layer and thermal
vias to bottom layer ground plane. For better thermal performance, larger copper pad for heat-sink is needed.
9. Test condition for MSOP-8EP: Device mounted on FR-4 PCB (51mm x 51mm 2oz copper, minimum recommended pad layout on top layer and
thermal vias to bottom layer with maximum area ground plane. For better thermal performance, larger copper pad for heat-sink is needed.
10. Dominant conduction path via Gnd pin (pin 2).
11. Dominant conduction path via exposed pad.