Diodes AL8807Q - Manual (Page 3)

AL8807Q
Document number: DS36904 Rev. 1 - 2
3 of 16
www.diodes.com
March 2014
© Diodes Incorporated
AL8807Q
Recommended Operating Conditions
(@T
A
= +25°C, unless otherwise specified.)
Symbol Parameter Min Max Unit
V
IN
Operating Input Voltage relative to GND 6.0 30 V
V
CTRLH
Voltage High for PWM dimming relative to GND 2.6 5.5 V
V
CTRLDC
Voltage range for 20% to 100% DC dimming relative to GND 0.5 2.5 V
V
CTRLL
Voltage Low for PWM dimming relative to GND 0 0.4 V
f
SW
Maximum switching frequency — 1 MHz
I
SW
Continuous switch current — 1.3 A
T
J
Junction Temperature Range -40 125 °C
Electrical Characteristics
(@ V
IN
= 12V, T
A
= +25°C, unless otherwise specified.)
Symbol Parameter Conditions Min Typ Max Unit
V
INSU
Internal regulator start up threshold V
IN
rising — — 5.9 V
V
INSH
Internal regulator hysteresis threshold V
IN
falling 100 — 300 mV
I
Q
Quiescent current Output not switching (Note 5) — — 350 µA
I
S
Input supply Current CTRL pin floating f = 250kHz — 1.8 5 mA
V
TH
Set current Threshold Voltage — 95 100 105 mV
V
TH-H
Set threshold hysteresis — — ±20 — mV
I
SET
SET pin input current V
SET
= V
IN
-0.1 — 16 22 µA
R
CTRL
CTRL pin input resistance Referred to internal reference — 50 — kΩ
V
REF
Internal Reference Voltage — — 2.5 — V
R
DS(on)
On Resistance of SW MOSFET I
SW
= 1A — 0.25 0.4 Ω
t
R
SW rise time V
SENSE
= 100±20mV, f
SW
= 250kHz
V
SW
= 0.1V~12V~0.1V C
L
= 15pF
— 12 — ns
t
F
SW fall time — 20 — ns
I
SW_Leakage
Switch leakage current V
IN
=30V — — 0.5 μA

JA
Thermal Resistance Junction-to-
Ambient (Note 6)
(Note 7) — 69 — C/W

JC
Thermal Resistance Junction-to-case
(Note 8)
(Note 7) — 4.3 — —
Notes: 5. AL8807Q does not have a low power standby mode but current consumption is reduced when output switch is inhibited: V
SENSE
= 0V. Parameter is
tested with V
CTRL
≤ 2.5V
6. Refer to figure 35 for the device derating curve.
7. Test condition for MSOP-8EP: Device mounted on FR-4 PCB (51mm x 51mm 2oz copper, minimum recommended pad layout on top layer and
thermal vias to bottom layer with maximum area ground plane. For better thermal performance, larger copper pad for heat-sink is needed
8. Dominant conduction path via exposed pad.