Diodes AL8808 - Manual (Page 3)

AL8808
Document number: DS35648 Rev. 2 - 2
3 of 20
www.diodes.com
January 2013
© Diodes Incorporated
NEW PROD
UC
T
AL8808
Recommended Operating Conditions
(@T
A
= +25°C, unless otherwise specified.)
Symbol Parameter Min Max Unit
V
IN
Operating Input Voltage Relative to GND 6.0 30 V
V
CTRLH
Voltage High for PWM Dimming Relative to GND 2.6 5.5 V
V
CTRLDC
Voltage Range for 20% to 100% DC Dimming Relative to GND 0.5 2.5 V
V
CTRLL
Voltage Low for PWM Dimming Relative to GND 0 0.4 V
I
SW
Continuous Switch Current (Note 4) 1 A
f
SW
Maximum Switching Frequency 1 MHz
T
J
Junction Temperature Range -40 +125 °C
Note: 4. Subject to ambient temperature, input voltage and switching frequency. See applications section for suggested derating.
Electrical Characteristics
(@ T
A
= +25°C, V
IN
= 12V, CTRL pin floating; unless otherwise specified.)
Symbol Parameter Conditions Min Typ Max Unit
V
INSU
Internal Regulator Start Up Voltage V
IN
rising 5.6 V
V
INSH
Internal Regulator Hysteresis Threshold V
IN
falling 200 mV
I
Q
Quiescent Current V
IN
= 30V, output not switching 350 µA
I
S
Input Supply Current f
SW
= 250kHz 450 µA
V
TH
Set Current Threshold Voltage 95 100 105 mV
V
TH-H
Set Threshold Hysteresis ±20 mV
I
SET
SET Pin Input Current V
SET
= V
IN
-0.1 16 µA
V
CTRL
Open Circuit CTRL Pin Voltage 5 V
R
CTRL
CTRL Pin Input Resistance Referred to internal 5V regulator. 50 kΩ
V
REF
Internal Reference Voltage 2.5 V
R
DS(on)
On Resistance of SW MOSFET I
SW
= 0.35A 0.35 Ω
I
SW_Lkg
Switch Leakage Current V
IN
= 30V, V
CTRL
= 0.4V, V
SENSE
= 0V 0.5 µA
t
R
SW Rise Time V
SENSE
= 100 ±20mV, f
SW
= 250kHz
V
SW
= 0.1V to 12V to 0.1V, C
L
= 15pF
7 ns
t
F
SW Fall Time 5 ns
T
OTP
Over-Temperature Shutdown 145 °C
T
OTP-Hyst
Over-Temperature Hysteresis 10 °C
θ
JA
Thermal Resistance Junction-to-Ambient TSOT25 (Note 5) 209
°C/W θ
JL
Thermal Resistance Junction-to-Lead TSOT25 (Note 5) 57
θ
JT
Thermal Resistance Junction-to-Top TSOT25 (Note 5) 13
Notes: 5. Device mounted on FR-4 PCB (25mm x 25mm 1oz copper, minimum recommended pad layout on top layer and thermal vias to maximum area
bottom layer ground plane. For better thermal performance, larger copper pad for heat-sink is needed.
…Refer to Figure 42 for the device derating curve.