Recommended operating conditions, Electrical characteristics, Ap8803 – Diodes AP8803 User Manual

Page 3

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AP8803

Document number: DS31970 Rev. 5 - 2

3 of 10

www.diodes.com

August 2012

© Diodes Incorporated

AP8803



Recommended Operating Conditions

(@T

A

= +25°C, unless otherwise specified.)


Symbol Parameter Min

Max

Unit

V

IN

Operating

Input

Voltage

8.0

30

V

V

CTRLH

Voltage

High

0.3

2.5

V

V

CTRLL

Voltage

Low

0.25

V

I

SW

Continuous Switch Current (Note 5)

1

A

T

A

Ambient Temperature Range

-40

+125

°C

Duty Cycle

Using Inductor

≥ 100µH (Note 4)

0.1

0.95

Notes:

4. For most applications the LED current will be within 8% over the duty cycle range specified. Duty cycle accuracy is also dependent on

propagation delay. Smaller size inductors can be used but LED current accuracy may be greater than 8% at extremes of duty cycle. This is

most noticeable at low duty cycles (less than 0.1) or when the input voltage is high and only one LED is being driven.

5. Refer to Figure 8 for the device derating curve.



Electrical Characteristics

(@T

A

= +25°C, unless otherwise specified.)


Symbol Parameter

Conditions Min

Typ

Max

Unit

V

INSU

Internal Regulator Start-Up Threshold

V

IN

rising

5.65 V

V

INSD

Internal Regulator Shutdown Threshold V

IN

falling

5.55 V

I

Q

Quiescent Current

CTRL pin floating f = 250kHz

1.8

5

mA

V

THD

Internal Threshold Voltage

92

100

108

mV

I

SET

SET Pin Input Current

V

SET

= V

IN

-0.1

1.25

10

µA

V

REF

Internal Reference Voltage

1.25

V

R

DS(on)

On Resistance of MOSFET

I

SW

= 1A

0.5

1

I

SW

Continuous Switch Current

(Note 5)

1

A

I

SW_Leakage

Switch

Leakage

Current

8

µA

f

OSC

Switching

Frequency

0.7 MHz

θ

JA

Thermal Resistance Junction-to-
Ambient

TSOT25 (Note 6)

125

°C/W

Notes:

5. Refer to Figure 8 for the device derating curve.

6. Test condition for TSOT25: Device mounted on FR-4 PCB, 25mm x 25mm, 2oz copper, minimum recommended pad layout on top layer and

thermal vias to bottom layer ground plane. For better thermal performance, larger copper pad for heat-sink is needed.

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