Operating and package characteristics – Diodes 74AUP1G09 User Manual
Page 7
74AUP1G09
Document number: DS35151 Rev. 2 - 2
7 of 14
July 2013
© Diodes Incorporated
74AUP1G09
Operating and Package Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Parameter
Test
Conditions
V
CC
Typ Unit
C
pd
Power Dissipation
Capacitance
f = 1MHz
No Load
0.8V 6.5
pF
1.2V ± 0.1V
6.3
1.5V ± 0.1V
6.3
1.8V ± 0.15V
6.2
2.5V ± 0.2V
6.2
3.3V ± 0.3V
6.1
C
i
Input Capacitance
V
i
= V
CC
or GND
0V or 3.3V
1.5
pF
θ
JA
Thermal Resistance
Junction-to-Ambient
SOT353
(Note 6)
371
°C/W
X2-DFN0808-4
430
X2-DFN1010-6
445
X2-DFN1409-6
470
X2-DFN1410-6
460
θ
JC
Thermal Resistance
Junction-to-Case
SOT353
(Note 6
143
°C/W
X2-DFN0808-4
240
X2-DFN1010-6
250
X2-DFN1409-6
275
X2-DFN1410-6
265
Note:
6. Test condition for , SOT353, X2-DFN0808-4:, X2-DFN1010-6 X2-DFN1409-6 and X2-DFN1410-6: Device mounted on FR-4 substrate PC board,
2oz copper, with minimum recommended pad layout.