Dfls120lq, Maximum ratings, Thermal characteristics – Diodes DFLS120LQ User Manual

Page 2: Electrical characteristics

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PowerDI is a registered trademark of Diodes Incorporated.

DFLS120LQ

Document number: DS37059 Rev. 1 - 2

2 of 5

www.diodes.com

March 2014

© Diodes Incorporated

DFLS120LQ




Maximum Ratings

(@T

A

= +25°C, unless otherwise specified.)

Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.

Characteristic

Symbol

Value

Unit

Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage

V

RRM

V

RWM

V

R

20

V

RMS Reverse Voltage

V

R(RMS)

14

V

Average Forward Current

I

F(AV)

1.0

A

Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load

I

FSM

50

A



Thermal Characteristics

Characteristic

Symbol

Value

Unit

Power Dissipation (Note 6)

P

D

1.67 W

Power Dissipation (Note 7)

P

D

556

mW

Thermal Resistance Junction to Ambient (Note 6)

R

θJA

60 °C/W

Thermal Resistance Junction to Ambient (Note 7)

R

θJA

180

C/W

Thermal Resistance Junction to Soldering (Note 8)

R

θJS

10 °C/W

Operating Temperature Range

T

J

-55 to +125

C

Storage Temperature Range

T

STG

-55 to +150

°C



Electrical Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

Reverse Breakdown Voltage (Note 10)

V

(BR)R

20

V

I

R

= 1.0mA

Forward Voltage

V

F



0.20
0.30
0.32



0.36

V

I

F

= 0.1A

I

F

= 0.7A

I

F

= 1.0A

Leakage Current (Note 10)

I

R



0.26

1.0

mA

V

R

= 5V, T

A

= +25°C

V

R

= 20V, T

A

= +25°C

Total Capacitance

C

T

75

pF

V

R

= 10V, f = 1.0MHz

Notes:

6. Part mounted on 50.8mm X 50.8mm GETEK board with 25.4mm X 25.4mm copper pad, 25% anode, 75% cathode. T

A

= +25°C.

7. Part mounted on FR-4 board with 1.8mm X 2.5mm cathode and 1.8mm X 1.2mm anode, 1 oz. copper pads. T

A

= +25°C.

8. Theoretical R

θJS

calculated from the top center of the die straight down to the PCB/cathode tab solder junction.

9. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes.

10. Short duration pulse test used to minimize self-heating effect.






















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