Diodes DFLS230 - Manual

e 3
DS30518 Rev. 2 - 1 1 of 3 DFLS230
PowerDI is a trademark of Diodes Incorporated. www.diodes.com
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Diodes Incorporated
DFLS230
2.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
PowerDI
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123
B
A
A
C
E
L4
L L1
E
H
D
L3
L2
L
Maximum Ratings @ T
A
= 25 °C unless otherwise specified
·
Guard Ring Die Construction for
Transient Protection
·
Low Power Loss, High Efficiency
·
Patented Interlocking Clip Design for High Surge Current
Capacity
·
Low Forward Voltage Drop
·
Lead Free Finish, RoHS Compliant (Note 5)
·
"Green" Molding Compound (No Br, Sb)
Mechanical Data
Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage V
RRM
V
RWM
V
R
30 V
RMS Reverse Voltage V
R(RMS) 21 V
Average Forward Current @ T
T
= 120°C I
F(AV) 2.0 A
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load
I
FSM 40 A
Power Dissipation (Note 1) P
D 1.67 W
Power Dissipation (Note 2) P D 556 mW
Thermal Resistance Junction to Ambient (Note 1) R qJA 60 °C/W
Thermal Resistance Junction to Ambient (Note 2) R qJA 180 °C/W
Thermal Resistance Junction to Soldering (Note 3) R qJS 10 °C/W
Operating Temperature Range T
j -55 to +125 °C
Storage Temperature Range T STG -55 to +150 °C
·
Case: PowerDI
ä
123
·
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
·
Moisture Sensitivity: Level 1 per J-STD-020C
·
Terminal Connections: Cathode Band
·
Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
·
Marking & Type Code Information: See Last Page
·
Ordering Information: See Last Page
·
Weight: 0.01 grams (approximate)
Electrical Characteristics @ T
A
= 25 °C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 4) V (BR)R 30 ¾ ¾ V I R = 1.5mA
Forward Voltage V
F
¾
¾
0.36
0.4
0.42
0.49
V
I
F
= 1.0A
I F = 2.0A
Leakage Current (Note 4) I
R
¾ 0.15 1.0 mA V
R
= 30V, T
A
= 25 °C
Total Capacitance C
T
¾ 75 ¾ pF V
R
= 10V, f = 1.0MHz
Features
Notes: 1. Part mounted on 50.8mm X 50.8mm GETEK board with 25.4mm X 25.4mm copper pad, 25% anode, 75% cathode. T A
= 25 °C
2. Part mounted on FR-4 board with 1.8mm X 2.5mm cathode and 1.8mm X 1.2mm anode, 1 oz. copper pads. T A
= 25 °C
3. Theoretical R qJS calculated from the top center of the die straight down to the PCB cathode tab solder junction.
4. Short duration pulse test to minimize self-heating effect.
5. RoHS revision 13.2.2003. High Temperature Solder Exemption Applied, see
EU Directive Annex Note 7 .
PowerDI ä 123
Dim Min Max Typ
A 3.50 3.90 3.70
B 2.60 3.00 2.80
C 1.63 1.93 1.78
D 0.93 1.00 0.98
E 0.85 1.25 1.00
H 0.15 0.25 0.20
L 0.45 0.85 0.65
L1 — — 1.35
L2 — — 1.10
L3 — — 0.20
L4 0.90 1.30 1.05
All Dimensions in mm