Diodes DFLS140LQ - Manual (Page 2)

PowerDI is a registered trademark of Diodes Incorporated
DFLS140LQ
Document number: DS37061 Rev. 1 – 2
2 of 5
www.diodes.com
March 2014
© Diodes Incorporated
DFLS140LQ
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage V
RRM
V
RWM
V
R
40 V
RMS Reverse Voltage V
R(RMS)
28 V
Average Forward Current @ T
T
= +120°C I
F(AV)
1.0 A
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load
I
FSM
50 A
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 6) P
D
1.67 W
Power Dissipation (Note 7) P
D
556 mW
Thermal Resistance Junction to Soldering Point (Note 8) R
θJS
10 °C/W
Thermal Resistance Junction to Ambient (Note 6) R
θJA
60 °C/W
Thermal Resistance Junction to Ambient (Note 7) R
θJA
180 °C/W
Operating Temperature Range T
J
-55 to +125 °C
Storage Temperature Range T
STG
-55 to +150 °C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 9) V
(BR)R
40   V I
R
= 500μA
Forward Voltage V
F





 




 0.36
0.30

0.55
0.515
0.85
0.88
V
I
F
= 0.1A, T
J
= +25°C
I
F
= 0.1A, T
J
= +85°C
I
F
= 1.0A, T
J
= +25°C
I
F
= 1.0A, T
J
= +85°C
I
F
= 3.0A, T
J
= +25°C
I
F
= 3.0A, T
J
= +85°C
Leakage Current (Note 9) I
R



 


 0.1
10
0.05
5
mA
V
R
= 40V, T
J
= +25°C
V
R
= 40V, T
J
= +85°C
V
R
= 20V, T
J
= +25°C
V
R
= 20V, T
J
= +85°C
Total Capacitance C
T
 90  pF V
R
= 10V, f = 1.0MHz
Notes: 6. Part mounted on 50.8mm X 50.8mm GETEK board with 25.4mm X 25.4mm copper pad, 25% anode, 75% cathode. T
A
= +25°C
7. Part mounted on FR-4 board with 1.8mm X 2.5mm cathode and 1.8mm X 1.2mm anode, 1 oz. copper pads.T
A
= +25°C
8. Theoretical R
θJS
calculated from the top center of the die straight down to the PCB cathode tab solder junction.
9. Short duration pulse test to minimize self-heating effect.