Diodes DFLS130 User Manual
Dfls130, Features, Mechanical data
DFLS130
Document number: DS30445 Rev. 4 - 2
1 of 3
www.diodes.com
June 2008
© Diodes Incorporated
DFLS130
PowerDI is a registered trademark of Diodes Incorporated.
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
®
Features
•
Guard Ring Die Construction for Transient Protection
•
Low Power Loss, High Efficiency
•
High Surge Capability
•
High Current Capability and Low Forward Voltage Drop
•
Lead Free Finish, RoHS Compliant (Note 5)
•
"Green" Molding Compound (No Br, Sb)
•
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
•
Case: PowerDI
®
123
•
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
•
Moisture Sensitivity: Level 1 per J-STD-020D
•
Terminal Connections: Cathode Band
•
Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
•
Marking Information: See Page 2
•
Ordering Information: See Page 2
•
Weight: 0.01 grams (approximate)
Top View
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
R
30
V
RMS Reverse Voltage
V
R(RMS)
21
V
Average Forward Current
I
F(AV)
1.0
A
Non-Repetitive Peak Forward Surge Current 8.3ms
Single half sine-wave Superimposed on Rated Load
I
FSM
35
A
Thermal Characteristics
Characteristic
Symbol
Typ
Max
Unit
Power Dissipation (Note 1)
P
D
⎯
1.67 W
Power Dissipation (Note 2)
P
D
⎯
556
mW
Thermal Resistance Junction to Ambient (Note 1)
R
θJA
⎯
60 °C/W
Thermal Resistance Junction to Ambient (Note 2)
R
θJA
⎯
180
°C/W
Thermal Resistance Junction to Soldering (Note 3)
R
θJS
⎯
10 °C/W
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 4)
V
(BR)R
30
⎯
⎯
V
I
R
= 1.5mA
Forward Voltage (Note 4)
V
F
⎯
⎯
⎯
0.25
0.33
0.36
⎯
0.37
0.42
V
I
F
= 0.1A
I
F
= 0.7A
I
F
= 1.0A
Leakage Current (Note 4)
I
R
⎯
0.15 1.0 mA
V
R
= 30V, T
A
= 25
°C
Total Capacitance
C
T
⎯
40
⎯
pF
V
R
= 10V, f = 1.0MHz
Notes:
1. Part mounted on 50.8mm X 50.8mm GETEK board with 25.4mm X 25.4mm copper pad, 25% anode, 75% cathode.
2. Part mounted on FR-4 board with 1.8mm X 2.5mm cathode and 1.8mm X 1.2mm anode, 1 oz. copper pads.
3. Theoretical R
θJS
calculated from the top center of the die straight down to the PCB cathode tab solder junction.
4. Short duration pulse test used to minimize self-heating effect.
5. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes.