Diodes ES2G - Manual

ES2G
Document number: DS30212 Rev. 8 - 2
1 of 4
www.diodes.com
September 2010
© Diodes Incorporated
ES2G
2.0A SURFACE MOUNT SUPER-FAST RECTIFIER
Features
•
Glass Passivated Die Construction
• Super-Fast Recovery Time For High Efficiency
•
Surge Overload Rating to 50A Peak
•
Ideally Suited for Automated Assembly
• Lead Free Finish/RoHS Compliant (Note 1)
• Green Molding Compound (No Halogen and Antimony)
(Note 2)
Mechanical Data
• Case:
SMB
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals: Lead Free Plating (Matte Tin Finish). Solderable per
MIL-STD-202, Method 208
• Polarity: Cathode Band or Cathode Notch
•
Marking Information: See Page 3
•
Ordering Information: See Page 3
• Weight: 0.093 grams (approximate)
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage (Note 6) V
RRM
V
RWM
V R
400 V
RMS Reverse Voltage V
R(RMS)
280 V
Average Rectified Output Current @ T
T
= 110 °C I
O
2.0 A
Non-Repetitive Peak Forward Surge Current8.3ms
Single Half Sine-Wave Superimposed on Rated Load
I
FSM
50 A
Thermal Characteristics
Characteristic Symbol Value Unit
Typical Thermal Resistance, Junction to Terminal (Note 3) R θJT 20 °C/W
Operating and Storage Temperature Range T
J,
T
STG
-55 to +150
°C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Unit
Forward Voltage @ I
F
= 2.0A V
FM
1.25 V
Peak Reverse Current @ T
A
= 25 °C
at Rated DC Blocking Voltage (Note 6) @ T
A
= 125 °C
I
RM
5.0
350
μA
Reverse Recovery Time (Note 5) t rr
35 ns
Typical Capacitance (Note 4) C
T
25 pF
Notes: 1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes.
2. Product manufactured with Data Code 0924 (week 24, 2009) and newer are built with Green Molding Compound.
3. Unit mounted on PC board with 5.0 mm
2 (0.013 mm thick) copper pads as heat sink.
4. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
5. Measured with I
F
= 0.5A, I
R
= 1.0A, I
rr
= 0.25A. See Figure 5.
6. Short duration pulse test used to minimize self-heating effect
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Green