Diodes DF005M - DF10M User Manual

Features, Mechanical data, Maximum ratings and electrical characteristics

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DF005M - DF10M

1.0A GLASS PASSIVATED BRIDGE RECTIFIERS

Features

Glass Passivated Die Construction

Low Forward Voltage Drop, High Current Capability

Surge Overload Rating to 50A Peak

Designed for Printed Circuit Board Applications

UL Listed Under Recognized Component Index, File
Number E94661

Lead Free Finish, RoHS Compliant (Date Code 0532+)
(Note 3)

Mechanical Data

Case: DF-M

Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020C

Terminals: Finish - Tin. Solder Plated Leads,
Solderable per MIL-STD-202, Method 208

Polarity: As Marked on Case

Marking Information: Type Number, See Page 3

Weight: 0.38 grams (approximate)

DF-M

Dim

Min

Max

A

7.40

7.90

B

6.20

6.50

C

0.22

0.30

D

1.27

2.03

E

7.60

8.90

G

3.81

4.69

H

8.13

8.51

J

2.40

3.40

K

5.00

5.20

L

0.46

0.58

All Dimensions in mm

E

H

L

K

A

D

C

G

B

J

Maximum Ratings and Electrical Characteristics

@T

A

= 25°C unless otherwise specified

Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.

Characteristic

Symbol

DF

005M

DF

01M

DF

02M

DF

04M

DF

06M

DF

08M

DF

10M

Unit

Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage

V

RMM

V

RWM

V

R

50

100

200

400

600

800

1000

V

RMS Reverse Voltage

V

RMS

35

70

140

280

420

580

700

V

Average Rectified Output Current @ T

A

= 40°C

I

O

1.0

A

Non-Repetitive Peak Forward Surge Current, 8.3 ms
Single Half Sine-Wave Superimposed on Rated Load

I

FSM

50

A

Forward Voltage (per element) @ I

F

= 1.0 A

V

FM

1.1

V

Peak Reverse Current @ T

A

= 25°C

at Rated DC Blocking Voltage (per element) @ T

A

= 125°C

I

RM

10

500

µA

I

2

t Rating for Fusing (t<8.3ms)

I

2

t

10.4

A

2

s

Typical Total Capacitance per element (Note 1)

C

T

25

pF

Typical Thermal Resistance, Junction to Ambient (Note 2)

R

θJA

40

°C/W

Operating and Storage Temperature Range

T

j

, T

STG

-65 to +150

°C

Notes:

1. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
2. Thermal Resistance, junction to ambient, measured on PC board with 5.0mm

2

(0.03mm thick) land areas.

3. R

οHS revision 13.2.2003. Glass and high temperature solder exemptions applied, see EU Directive Annex Notes 5 and 7.




DS21201 Rev. 15 - 2

1 of 3

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DF005M-DF10M

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