Diodes DF005M - DF10M User Manual

Features, Mechanical data, Maximum ratings and electrical characteristics

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DF005M - DF10M

1.0A GLASS PASSIVATED BRIDGE RECTIFIERS

Features

•

Glass Passivated Die Construction

•

Low Forward Voltage Drop, High Current Capability

•

Surge Overload Rating to 50A Peak

•

Designed for Printed Circuit Board Applications

•

UL Listed Under Recognized Component Index, File
Number E94661

•

Lead Free Finish, RoHS Compliant (Date Code 0532+)
(Note 3)

Mechanical Data

•

Case: DF-M

•

Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0

•

Moisture Sensitivity: Level 1 per J-STD-020C

•

Terminals: Finish - Tin. Solder Plated Leads,
Solderable per MIL-STD-202, Method 208

•

Polarity: As Marked on Case

•

Marking Information: Type Number, See Page 3

•

Weight: 0.38 grams (approximate)

DF-M

Dim

Min

Max

A

7.40

7.90

B

6.20

6.50

C

0.22

0.30

D

1.27

2.03

E

7.60

8.90

G

3.81

4.69

H

8.13

8.51

J

2.40

3.40

K

5.00

5.20

L

0.46

0.58

All Dimensions in mm

E

H

L

K

A

D

C

G

B

J

Maximum Ratings and Electrical Characteristics

@T

A

= 25°C unless otherwise specified

Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.

Characteristic

Symbol

DF

005M

DF

01M

DF

02M

DF

04M

DF

06M

DF

08M

DF

10M

Unit

Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage

V

RMM

V

RWM

V

R

50

100

200

400

600

800

1000

V

RMS Reverse Voltage

V

RMS

35

70

140

280

420

580

700

V

Average Rectified Output Current @ T

A

= 40°C

I

O

1.0

A

Non-Repetitive Peak Forward Surge Current, 8.3 ms
Single Half Sine-Wave Superimposed on Rated Load

I

FSM

50

A

Forward Voltage (per element) @ I

F

= 1.0 A

V

FM

1.1

V

Peak Reverse Current @ T

A

= 25°C

at Rated DC Blocking Voltage (per element) @ T

A

= 125°C

I

RM

10

500

µA

I

2

t Rating for Fusing (t<8.3ms)

I

2

t

10.4

A

2

s

Typical Total Capacitance per element (Note 1)

C

T

25

pF

Typical Thermal Resistance, Junction to Ambient (Note 2)

R

θJA

40

°C/W

Operating and Storage Temperature Range

T

j

, T

STG

-65 to +150

°C

Notes:

1. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
2. Thermal Resistance, junction to ambient, measured on PC board with 5.0mm

2

(0.03mm thick) land areas.

3. R

οHS revision 13.2.2003. Glass and high temperature solder exemptions applied, see EU Directive Annex Notes 5 and 7.




DS21201 Rev. 15 - 2

1 of 3

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DF005M-DF10M

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