Diodes DLPA006 User Manual
Features, Data line transient protection, Mechanical data
DLPA006
Document number: DS30665 Rev. 8 - 2
1 of 4
www.diodes.com
October 2008
© Diodes Incorporated
DLPA006
DATA BUS TRANSIENT SUPPRESSOR / 3-PHASE FULL WAVE BRIDGE RECTIFIER
Features
•
Fast Switching Speed
•
Ultra-Small Surface Mount Package
•
Ideal For Three Dataline Rail Clamp or Three Phase Full Wave
Bridge Rectification
•
Lead Free By Design/RoHS Compliant (Note 4)
•
"Green" Device (Note 5)
Data Line Transient Protection
In accordance with (Note 1):
•
IEC 61000-4-2 Contact Method: ±15kV
•
IEC 61000-4-2 Air Discharge Method: ±25kV
Mechanical Data
•
Case: SOT-363
•
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0 (Note 4)
•
Moisture Sensitivity: Level 1 per J-STD-020D
•
Terminals: Finish
⎯ Matte Tin annealed over Alloy 42
Leadframe. Solderable per MIL-STD-202, Method 208
•
Ordering Information: See Page 2
•
Marking Information: See Page 2
•
Weight: 0.006 grams (approximate)
DC
V
+
CC
DC
V
+
CC
AC
DL
3
3
/
/
/
/
/
/
DL
AC
1
1
DL
AC
2
2
GND
DC-
SOT-363
Internal Schematic
TOP VIEW
TOP VIEW
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
R
85
V
RMS Reverse Voltage
V
R(RMS)
60
V
Forward Current (Single Diode)
I
FM
160
mA
Non-Repetitive Peak Forward Surge Current
@ t = 1.0
μs
@ t = 1.0ms
@ t = 1.0s
I
FSM
4.0
1.0
0.5
A
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 2)
P
D
200
mW
Power Dissipation (Note 3)
P
D
300
mW
Thermal Resistance Junction to Ambient Air (Note 2)
R
θJA
625
°C/W
Thermal Resistance Junction to Ambient Air (Note 3)
R
θJA
417
°C/W
Operating and Storage Temperature Range
T
J
, T
STG
-65 to +150
°C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 6)
V
(BR)R
85
⎯
⎯
V
I
R
= 100
μA
Forward Voltage
V
F
⎯
⎯
0.90
1.0
1.1
1.25
V
I
F
= 1.0mA
I
F
= 10mA
I
F
= 50mA
I
F
= 150mA
Leakage Current (Note 6)
I
R
⎯
⎯
5.0
80
nA
nA
V
R
= 75V
V
R
= 75V, T
J
= 150
°C
Total Capacitance (per element)
C
T
⎯
2
⎯
pF
V
R
= 0, f = 1.0MHz
Capacitance Between Two Data Lines (DL
1
& DL
2
, DL
1
& DL
3
) C
LL
⎯
1.6 2.6 pF
V
R
= 0, f = 1.0MHz
Capacitance Between Data Line and Ground
C
LG
⎯
2.5 3.5 pF
V
R
= 0, f = 1.0MHz
Reverse Recovery Time
t
rr
⎯
⎯
3.0
μs
I
F
= I
R
= 10mA,
I
rr
= 0.1 x I
R
, R
L
= 100
Ω
Notes:
1. Tested with V
CC
pins connected to GND pin.
2. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. Device mounted on Alumina PCB, 0.4 inch x 0.3 inch x 0.024 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
4. No purposefully added lead.
5. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
6. Short duration pulse test used to minimize self-heating.