Diodes DXT3150 User Manual

Dxt3150, Features, Mechanical data

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DXT3150

NPN SURFACE MOUNT TRANSISTOR

Features

•

Epitaxial Planar Die Construction

•

Ideally Suited for Automated Assembly Processes

•

Ideal for Medium Power Switching or Amplification Applications

•

Lead Free By Design/RoHS Compliant (Note 1)

•

"Green" Device (Note 2)

Mechanical Data

•

Case: SOT89-3L

•

Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0

•

Moisture Sensitivity: Level 1 per J-STD-020C

•

Terminals: Finish — Matte Tin annealed over Copper leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208

•

Marking & Type Code Information: See Page 3

•

Ordering Information: See Page 3

•

Weight: 0.072 grams (approximate)

NEW PROD

UC

T

SOT89-3L

3

1

2,4

COLLECTOR

EMITTER

BASE

4

3

2

1

C

C

B

E

TOP VIEW

Schematic and Pin Configuration

Maximum Ratings

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Value

Unit

Collector-Base Voltage

V

CBO

50 V

Collector-Emitter Voltage

V

CEO

25 V

Emitter-Base Voltage

V

EBO

7 V

Continuous Collector Current

I

C

5 A

Thermal Characteristics

Characteristic Symbol

Value

Unit

Power Dissipation (Note 3) @ T

A

= 25°C

P

D

1 W

Thermal Resistance, Junction to Ambient Air (Note 3) @T

A

= 25°C

R

θJA

125 °C/W

Operating and Storage Temperature Range

T

j

, T

STG

-55 to +150

°C

Electrical Characteristics

@T

A

= 25°C unless otherwise specified

Characteristic

Symbol Min Typ Max Unit

Test

Conditions

OFF CHARACTERISTICS (Note 4)
Collector-Emitter Breakdown Voltage

V

(BR)CEO

25

⎯

⎯

V

I

C

= 10mA, I

B

= 0

Collector Cut-off Current

I

CBO

⎯

⎯

1.0

μA V

CB

= 50V, I

E

= 0

Emitter Cut-off Current

I

EBO

⎯

⎯

1.0

μA V

EB

= 7.0V, I

C

= 0

ON CHARACTERISTICS (Note 4)

Collector-Emitter Saturation Voltage

V

CE(SAT)

⎯

⎯

0.35
0.50

V

I

C

= 3.0A, I

B

= 150mA

I

C

= 4.0A, I

B

= 200mA

Base-Emitter Saturation Voltage

V

BE(SAT)

⎯

⎯

1.10
1.40

V

I

C

= 3.0A, I

B

= 150mA

I

C

= 4.0A, I

B

= 200mA

DC Current Gain

h

FE

250
150

50

⎯

550

⎯
⎯

⎯

I

C

= 500mA, V

CE

= 2.0V

I

C

= 2.0A, V

CE

= 2.0V

I

C

= 5.0A, V

CE

= 2.0V

SMALL SIGNAL CHARACTERISTICS

Current Gain-Bandwidth Product

f

T

⎯

220

⎯

MHz

I

C

= 50mA, V

CE

= 6.0V,

f = 100MHz

Output Capacitance

C

obo

⎯

⎯

50 pF

V

CB

= 10V, I

E

= 0, f = 1MHz


Notes:

1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
3. Device mounted on FR-4 PCB; pad layout as shown on page 3 or in Diodes Inc. suggested pad layout document AP02001, which can be found on our

website at http://www.diodes.com/datasheets/ap02001.pdf.

4. Measured under pulsed conditions. Pulse width = 300

μs. Duty cycle ≤2%.

DS31157 Rev. 3 - 2

1 of 3

www.diodes.com

DXT3150

© Diodes Incorporated

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