Diodes DSS4540X User Manual

Dss4540x new prod uc t, Features, Mechanical data

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DSS4540X

Document number: DS31592 Rev. 2 - 2

1 of 4

www.diodes.com

December 2008

© Diodes Incorporated

DSS4540X

NEW PROD

UC

T


LOW V

CE(SAT)

NPN SURFACE MOUNT TRANSISTOR

Features

Complementary PNP Type Available (DSS5540X)

Ultra Low Collector-Emitter Saturation Voltage

Ideally Suited for Automated Assembly Processes

Ideal for Medium Power Switching or Amplification Applications

Lead Free By Design/RoHS Compliant (Note 1)

"Green" Device (Note 2)

Mechanical Data

• Case:

SOT89-3L

Case Material: Molded Plastic, "Green” Molding Compound.
UL Flammability Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020D

Terminals: Finish — Matte Tin annealed over Copper leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208

Marking Information: See Page 4

Ordering Information: See Page 4

Weight: 0.072 grams (approximate)











Maximum Ratings

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Value

Unit

Collector-Base Voltage

V

CBO

40 V

Collector-Emitter Voltage

V

CEO

40 V

Emitter-Base Voltage

V

EBO

6 V

Continuous Collector Current

I

C

4 A

Repetitive Collector Current (Note 3)

I

CRM

5 A

Peak Pulse Collector Current

I

CM

10 A

Continuous Base Current

I

B

1 A

Peak Pulse Base Current

I

BM

2 A


Thermal Characteristics

Characteristic Symbol

Value

Unit

Power Dissipation (Note 4) @ T

A

= 25°C

P

D

0.9 W

Thermal Resistance, Junction to Ambient Air (Note 4) @ T

A

= 25°C

R

θJA

139 °C/W

Power Dissipation (Note 5) @ T

A

= 25°C

P

D

2 W

Thermal Resistance, Junction to Ambient Air (Note 5) @ T

A

= 25°C

R

θJA

62.5 °C/W

Operating and Storage Temperature Range

T

J

, T

STG

-55 to +150

°C

Notes:

1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
3. Operated under pulsed conditions: pulse width

≤ 10ms; duty cycle ≤ 0.2.

4. Device mounted on FR-4 PCB with minimum recommended pad layout.
5. Device mounted on FR-4 PCB with 1 inch

2

copper pad layout.


















Top View

Device Schematic

Pin Out Configuration

4

3

2

1

C

C

B

E

3

1

2,4

COLLECTOR

EMITTER

BASE

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