Diodes IMT17 - Manual

IMT17
Document number: DS31202 Rev. 4 - 2
1 of 4
www.diodes.com
March 2009
© Diodes Incorporated
IMT17
DUAL PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
•
Epitaxial Planar Die Construction
• Small Surface Mount Package
•
Lead Free By Design/RoHS Compliant (Note 1)
•
"Green" Device (Note 2)
Mechanical Data
• Case:
SOT-26
• Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
•
Terminal Connections: See Diagram
•
Terminals: Finish – Matte Tin Annealed Over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
•
Marking Information: See Page 3
•
Ordering Information: See Page 3
• Weight: 0.016 grams (approximate)
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Unit
Collector-Base Voltage V
CBO
-60 V
Collector-Emitter Voltage V
CEO
-50 V
Emitter-Base Voltage V
EBO
-5.0 V
Continuous Collector Current I
C
-500 mA
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 3) @T
A
= 25°C P
D
300 mW
Thermal Resistance, Junction to Ambient Air (Note 3) @T A = 25°C R θJA 417 °C /W
Operating and Storage Temperature Range T
J
, T
STG
-55 to +150 °C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 4)
Collector-Base Breakdown Voltage
V (BR)CBO
-60 — — V I
C = -100
μA
Collector-Emitter Breakdown Voltage V (BR)CEO
-50 — — V I
C = -1.0mA
Emitter-Base Breakdown Voltage V
(BR)EBO
-5.0 — — V I
E
= -100 μA
Collector Cutoff Current I
CBO
— — -0.1 μA V
CB
= -30V
Emitter Cutoff Current I
EBO
— — -0.1 μA V
EB
= -4.0V
ON CHARACTERISTICS (Note 4)
DC Current Gain
h
FE
120 — 390 — V
CE
= -3.0V, I
C
= -100mA
Collector-Emitter Saturation Voltage (Note 3) V
CE(SAT)
— — -0.6 V I
C
= -500mA, I
B
= -50mA
SMALL SIGNAL CHARACTERISTICS
Gain Bandwidth Product
f T
— 200 — MHz
V
CE
= -5V, I
E
= 20mA,
f = 100MHz
Output Capacitance C
ob
— 7 — pF V
CB
= -10V, I
E
= 0, f = 1MHz
Notes: 1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
3. Device mounted on FR-4 PCB; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on page 4 or on our
website at http://www.diodes.com/datasheets/ap02001.pdf.
4. Short duration pulse test used to minimize self-heating effect.
Top View Device Schematic
E2
C2
C1
E1
B2
B1
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