Diodes DDTD (xxxx) U - Manual

DDTD (xxxx) U
NPN PRE-BIASED 500 mA SURFACE MOUNT TRANSISTOR
Features
•
Epitaxial Planar Die Construction
DS30382 Rev. 7 - 2 1 of 3
www.diodes.com
DDTD (xxxx) U
© Diodes Incorporated
• Complementary PNP Types Available (DDTB)
• Built-In Biasing Resistors, R1, R2
•
Lead Free/RoHS Compliant Version (Note 2)
•
"Green" Device, Note 3 and 4
Mechanical Data
•
Case: SOT-323
•
Case Material: Molded Plastic, "Green" Molding
Compound, Note 4. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020C
•
Terminals: Solderable per MIL-STD-202, Method 208
•
Terminal Connections: See Diagram
•
Lead Free Plating (Matte Tin Finish annealed over
Alloy 42 leadframe).
• Marking Information: See Table Below & Page 3
•
Ordering Information: See Page 3
•
Weight: 0.006 grams (approximate)
P/N R1 (NOM) R2 (NOM) MARKING
DDTD113EU
DDTD123EU
DDTD143EU
DDTD114EU
DDTD122JU
DDTD113ZU
DDTD123YU
DDTD133HU
DDTD123TU
DDTD143TU
DDTD114TU
DDTD114GU 1K
2.2K
4.7K
10K
0.22K
1K
2.2K
3.3K
2.2K
4.7K
10K
0
1K
2.2K
4.7K
10K
4.7K
10K
10K
10K
OPEN
OPEN
OPEN
10K
N60
N61
N62
N63
N64
N65
N66
N67
N69
N70
N71
N72
SOT-323
Dim Min Max
A 0.25 0.40
B 1.15 1.35
C 2.00 2.20
D 0.65 Nominal
E 0.30 0.40
G 1.20 1.40
H 1.80 2.20
J 0.0 0.10
K 0.90 1.00
L 0.25 0.40
M 0.10 0.18
α
0
°
8
°
All Dimens mm ions in
Maximum Ratings
@T A = 25°C unless otherwise specified
R1
OUT
B
C
E
R2
3
2 1
IN GND(0)
A
M
J
L E D
B C
H
K
G
Schematic and Pin Configuration
Characteristic Symbol Value Unit
Supply Voltage, (3) to (2) V
CC
50 V
Input Voltage, (1) to (2) DDTD113EU
DDTD123EU
DDTD143EU
DDTD114EU
DDTD122JU
DDTD113ZU
DDTD123YU
DDTD133HU
V
IN
-10 to +10
-10 to +12
-10 to +30
-10 to +40
-5 to +5
-5 to +10
-5 to +12
-6 to +20
V
Input Voltage, (2) to (1) DDTD123TU
DDTD143TU
DDTD114TU
DDTD114GU
V
EBO (MAX)
5 V
Output Current All I
C
500 mA
Power Dissipation P d
200 mW
Thermal Resistance, Junction to Ambient Air (Note 1) R θJA 625 °C/W
Operating and Storage Temperature Range T
j
, T
STG
-55 to +150 °C
Notes: 1. Mounted on FR4 PC Board with recommended pad layout at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to
Date Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.