Diodes DMMT5401 User Manual
Dmmt5401, Features, Mechanical data
DMMT5401
MATCHED PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
DS30437 Rev. 6 - 2
1 of 4
www.diodes.com
DMMT5401
© Diodes Incorporated
•
Epitaxial Planar Die Construction
•
Complementary NPN Type Available (DMMT5551)
•
Ideal for Low Power Amplification and Switching
•
Intrinsically Matched PNP Pair (Note 1)
•
2% Matched Tolerance, h
FE
, V
CE(SAT)
, V
BE(SAT)
•
Lead Free/RoHS Compliant (Note 4)
•
"Green" Device (Note 5 and 6)
Mechanical Data
•
Case: SOT-26
•
Case Material: Molded Plastic, "Green" Molding
Compound, Note 6. UL Flammability Classification
Rating 94V-0
•
Moisture Sensitivity: Level 1 per J-STD-020C
•
Terminal Connections: See Diagram
•
Terminals: Solderable per MIL-STD-202, Method 208
•
Lead Free Plating (Matte Tin Finish annealed over
Copper leadframe).
•
Marking Information: K4S, See Page 3
•
Ordering & Date Code Information: See Page 3
•
Weight: 0.006 grams (approximate)
SOT-26
Dim
Min
Max
Typ
A
0.35
0.50
0.38
B
1.50
1.70
1.60
C
2.70
3.00
2.80
D
⎯
⎯
0.95
F
⎯
⎯
0.55
H
2.90
3.10
3.00
J
0.013
0.10
0.05
K
1.00
1.30
1.10
L
0.35
0.55
0.40
M
0.10
0.20
0.15
α
0
°
8
°
⎯
All Dimens ons in mm
i
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic
A
M
J
L
D
F
Symbol
Value
Unit
Collector-Base Voltage
V
CBO
-160
V
Collector-Emitter Voltage
V
CEO
-150
V
Emitter-Base Voltage
V
EBO
-5.0
V
Collector Current - Continuous (Note 2)
I
C
-200
mA
Power Dissipation (Note 2, 3)
P
d
300
mW
Thermal Resistance, Junction to Ambient (Note 2)
R
θJA
417
°C/W
Operating and Storage Temperature Range
T
j
, T
STG
-55 to +150
°C
Notes:
1. Built with adjacent die from a single wafer.
2. Device mounted on FR5 PCB: 1.0 x 0.75 x 0.62 in.; pad layout as shown on suggested pad layout document AP02001, which can be found on our
website at http://www.diodes.com/datasheets/ap02001.pdf.
3. Maximum combined dissipation.
4. No purposefully added lead.
5. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
6. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
B C
H
K
C
2
B
2
E
2
B
1
E
1
C
1
C
2
E
2
E
1
C
1
B
2
B
1
C
2
E
2
E
1
C
1
B
2
B
1