Package outline dimensions, Suggested pad layout, Dmn2005lpk – Diodes DMN2005LPK User Manual
Page 5
DMN2005LPK
Document number: DS30836 Rev. 9 - 2
5 of 6
June 2012
© Diodes Incorporated
DMN2005LPK
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1,000
Fig. 12 Transient Thermal Response
t , PULSE DURATION TIME (s)
1
0.001
0.01
0.1
1
r(
t),
T
R
A
N
SI
EN
T
T
H
E
R
MA
L
R
ES
IS
T
AN
C
E
T - T = P * R
(t)
Duty Cycle, D = t /t
J
A
JA
1 2
θ
R
(t) = r(t) *
θJA
R
R
= 221°C/W
θ
θ
JA
JA
P(pk)
t
1
t
2
D = 0.7
D = 0.3
D = 0.1
D = 0.05
D = 0.02
D = 0.01
D = 0.005
D = Single Pulse
D = 0.9
D = 0.5
Package Outline Dimensions
Suggested Pad Layout
X1-DFN1006-3
Dim
Min
Max Typ
A
0.47
0.53 0.50
A1
0
0.05 0.03
b1
0.10
0.20 0.15
b2
0.45
0.55 0.50
D
0.95
1.075 1.00
E
0.55
0.675 0.60
e
⎯
⎯
0.35
L1
0.20
0.30 0.25
L2
0.20
0.30 0.25
L3
⎯
⎯
0.40
All Dimensions in mm
Dimensions
Value (in mm)
Z
1.1
G1
0.3
G2
0.2
X
0.7
X1
0.25
Y
0.4
C
0.7
L2
A1
E
b2
L1
L3
D
e
b1
A
Y
C
G1
G2
X
X
1
Z