Maximum ratings, Thermal characteristics, Electrical characteristics – Diodes DMN2013UFX User Manual

Page 2: Dmn2013ufx

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DMN2013UFX

Document number: DS36657 Rev. 2 - 2

2 of 6

www.diodes.com

March 2014

© Diodes Incorporated

DMN2013UFX

Maximum Ratings

(@T

A

= +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Unit

Drain-Source Voltage

V

DSS

20 V

Gate-Source Voltage

V

GSS

±8 V

Continuous Drain Current (Note 5) V

GS

= 4.5V

Steady

State

T

A

= +25°C

T

A

= +70°C

I

D

10

8

A

Continuous Drain Current (Note 5) V

GS

= 2.5V

Steady

State

T

A

= +25°C

T

A

= +70°C

I

D

9
7

A

Pulsed Drain Current (Note 7)

I

DM

80 A



Thermal Characteristics

Characteristic Symbol

Max

Unit

Power Dissipation (Note 5)

P

D

0.78 W

Thermal Resistance, Junction to Ambient @T

A

= +25°C (Note 5)

R

θJA

163 °C/W

Power Dissipation (Note 6)

P

D

2.14 W

Thermal Resistance, Junction to Ambient @T

A

= +25°C (Note 6)

R

θJA

59 °C/W

Operating and Storage Temperature Range

T

J

,

T

STG

-55 to +150

°C



Electrical Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage

BV

DSS

20

— — V

V

GS

= 0V, I

D

= 250μA

Zero Gate Voltage Drain Current T

J

= +25°C

I

DSS

— — 1

μA

V

DS

= 16V, V

GS

= 0V

Gate-Source Leakage

I

GSS

— — ±10

μA

V

GS

= ±8V, V

DS

= 0V

ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage

V

GS(th)

0.5 — 1.1 V

V

DS

= V

GS

, I

D

= 250μA

Static Drain-Source On-Resistance

R

DS (ON)

8.4

11.5

mΩ

V

GS

= 4.5V, I

D

= 8.5A

8.5

12.0

V

GS

= 4.0V, I

D

= 8.5A

8.6

12.5

V

GS

= 3.5V, I

D

= 8.5A

9.0

13.5

V

GS

= 3.1V, I

D

= 8A

9.6

14.0

V

GS

= 2.5V, I

D

= 8A

Forward Transfer Admittance

|Y

fs

|

— 18.2 — S

V

DS

= 5V, I

D

= 4A

Diode Forward Voltage

V

SD

— — 1.2 V

V

GS

= 0V, I

S

= 8.5A

DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance

C

iss

— 2607 — pF

V

DS

= 10V, V

GS

= 0V,

f = 1.0MHz

Output Capacitance

C

oss

— 255 — pF

Reverse Transfer Capacitance

C

rss

— 236 — pF

Gate Resistance

R

g

— 1.2 — Ω

V

DS

= 0V, V

GS

= 0V, f = 1MHz

Total Gate Charge (V

GS

= 4.5V)

Q

g

— 32.4 — nC

V

DS

= 10V, I

D

= 8.5A

Total Gate Charge (V

GS

= 8V)

Q

g

— 57.4 — nC

Gate-Source Charge

Q

gs

— 3.5 — nC

Gate-Drain Charge

Q

gd

— 4.0 — nC

Turn-On Delay Time

t

D(on)

— 8.6 — ns

V

DS

= 10V, I

D

= 8.5A

V

GS

= 4.5V, R

G

= 1.8Ω

Turn-On Rise Time

t

r

— 20.3 — ns

Turn-Off Delay Time

t

D(off)

— 42.5 — ns

Turn-Off Fall Time

t

f

— 13.7 — ns

Notes:

5. Device mounted on FR-4 PCB with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate

7. Repetitive rating, pulse width limited by junction temperature.

8. Short duration pulse test used to minimize self-heating effect.

9. Guaranteed by design. Not subject to production testing.





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