Maximum ratings, Thermal characteristics, Electrical characteristics – Diodes DMG8880LK3 User Manual

Page 2

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DMG8880LK3

Document number: DS32052 Rev. 4 - 2

2 of 6

www.diodes.com

December 2010

© Diodes Incorporated

DMG8880LK3




Maximum Ratings

@T

A

= 25°C unless otherwise specified

Characteristic

Symbol

Value

Unit

Drain-Source Voltage

V

DSS

30 V

Gate-Source Voltage

V

GSS

±20 V

Continuous Drain Current (Note 4) V

GS

= 10V

Steady

State

T

A

= 25°C

T

A

= 85°C

I

D

11

8

A

Continuous Drain Current (Note 5) V

GS

= 10V

Steady

State

T

A

= 25°C

T

A

= 85°C

I

D

16.5

12

A

Pulsed Drain Current (Note 6)

I

DM

48 A




Thermal Characteristics

Characteristic Symbol

Value

Unit

Power Dissipation (Note 4)

P

D

1.68 W

Thermal Resistance, Junction to Ambient @T

A

= 25°C (Note 4)

R

θJA

74.3 °C/W

Power Dissipation (Note 5)

P

D

4.1 W

Thermal Resistance, Junction to Ambient @T

A

= 25°C (Note 5)

R

θJA

30.8 °C/W

Operating and Storage Temperature Range

T

J

,

T

STG

-55 to +150

°C




Electrical Characteristics

@T

A

= 25°C unless otherwise specified

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage

BV

DSS

30 - - V

V

GS

= 0V, I

D

= 250

μA

Zero Gate Voltage Drain Current T

J

= 25°C

I

DSS

- -

1.0

μA

V

DS

= 30V, V

GS

= 0V

Gate-Source Leakage

I

GSS

- -

±100

nA

V

GS

= ±20V, V

DS

= 0V

ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage

V

GS(th)

1.2 1.5 2.3 V V

DS

= V

GS

, I

D

= 250

μA

Static Drain-Source On-Resistance

R

DS (ON)

-

5
8

7.5

12

V

GS

= 10V, I

D

= 11.6A

V

GS

= 4.5V, I

D

= 10.7A

Forward Transfer Admittance

|Y

fs

|

- 22 - S

V

DS

= 15V, I

D

= 15A

Diode Forward Voltage

V

SD

- 0.7

1.0 V

V

GS

= 0V, I

SD

= 2.1A

DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance

C

iss

- 1289 - pF

V

DS

= 15V, V

GS

= 0V,

f = 1.0MHz

Output Capacitance

C

oss

- 187 - pF

Reverse Transfer Capacitance

C

rss

- 162 - pF

Gate Resistance

R

g

- 0.97 - Ω

V

DS

= 0V, V

GS

= 0V, f = 1MHz

Total Gate Charge at 10V

Q

g

- 27.6 - nC

V

GS

= 10V, V

DS

= 15V,

I

D

= 11.6A, Ig = 1.0mA

Total Gate Charge at 5V

Q

g

- 14.4 - nC

V

GS

= 5V, V

DS

= 15V,

I

D

= 11.6A

Gate-Source Charge

Q

gs

- 3.6 - nC

Gate-Drain Charge

Q

gd

- 4.9 - nC

Turn-On Delay Time

t

D(on)

- 7.04 - ns

V

DD

= 15V, V

GS

= 10V,

R

G

= 11

Ω, I

D

= 11.6A,

R

L

= 1.3

Turn-On Rise Time

t

r

- 17.52 -

ns

Turn-Off Delay Time

t

D(off)

- 36.13 -

ns

Turn-Off Fall Time

t

f

- 19.67 -

ns

Body Diode Reverse Recovery Time

t

rr

- 17.6 - ns

I

F

= 20A, dl/dt = 500A/

μs

Body Diode Reverse Recovery Charge

Q

rr

- 65.9 - nC

I

F

= 20A, dl/dt = 500A/

μs

Notes:

4. Device mounted on FR-4 PCB, with minimum recommended pad layout, single sided.

5. Device mounted on 2” x 2” FR-4 PCB with high coverage 2oz. copper, single sided.

6.

Repetitive rating, pulse width limited by junction temperature and current limited by package.

7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.



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