Diodes DMN32D2LV - Manual (Page 2)

DMN32D2LV
Document number: DS31121 Rev. 7 - 2
2 of 6
www.diodes.com
January 2014
© Diodes Incorporated
DMN32D2LV
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Unit
Drain Source Voltage V
DSS
30 V
Gate-Source Voltage V
GSS
10 V
Drain Current (Note 5) I
D
400 mA
Thermal Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Total Power Dissipation (Note 5) P
D
400 mW
Thermal Resistance, Junction to Ambient (Note 5) R
θJA
313 C/W
Operating and Storage Temperature Range T
J
, T
STG
-55 to +150 C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
BV
DSS
30   V V
GS
= 0V, I
D
= 250μA
Zero Gate Voltage Drain Current @ T
J
= +25°C I
DSS
  1 A V
DS
= 30V, V
GS
= 0V
Gate-Body Leakage @ T
J
= +25°C I
GSS



1
10
500
100
A
nA
nA V
GS
= ±10V, V
DS
= 0V
V
GS
= ±5V, V
DS
= 0V
V
GS
= ±2.5V, V
DS
= 0V
Gate-Body Leakage (Note 7) @ T
J
= +105°C
@ T
J
= +125°C
I
GSS

8
15
100
100 nA
nA
V
GS
= ±2.5V, V
DS
= 0V
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
V
GS(th)
0.6  1.2 V V
DS
= V
GS
, I
D
= 250μA
Static Drain-Source On-Resistance R
DS (ON)


 

 2.2
1.5
1.2
Ω
V
GS
= 1.8V, I
D
= 20mA
V
GS
= 2.5V, I
D
= 20mA
V
GS
= 4.0V, I
D
= 100mA
Forward Transconductance |Y
fs
| 100   mS V
DS
=10V, I
D
= 0.1A
Source-Drain Diode Forward Voltage V
SD
0.5  1.4 V V
GS
= 0V, I
S
= 115mA
DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance
C
iss
 39  pF
V
DS
= 3V, V
GS
= 0V
f = 1.0MHz
Output Capacitance C
oss
 10  pF
Reverse Transfer Capacitance C
rss
 3.6  pF
Switching Time
Turn-on Time t
on
 11  nS V
DD
= 5V, I
D
= 10 mA,
V
GS
= 5V Turn-off Time t
off
 51  nS
Notes: 5. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can
be found on our website at http://www.diodes.com.
6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to production testing.