Maximum ratings, Thermal characteristics – Diodes DMN6066SSS User Manual

Page 2

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DMN6066SSS

Document Number DS32110 Rev 2 - 2

2 of 9

www.diodes.com

November 2011

© Diodes Incorporated

A Product Line of

Diodes Incorporated

DMN6066SSS

ADVAN

CE I

N

F

O

RM

ATI

O

N






Maximum Ratings

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Value

Unit

Drain-Source voltage

V

DSS

60 V

Gate-Source voltage

(Note 2)

V

GS

±20

V

Single Pulsed Avalanche Energy

(Note 7)

E

AS

37.5 mJ

Single Pulsed Avalanche Current

(Note 7)

I

AS

5.0 A

Continuous Drain current

V

GS

= 10V

(Note 4)

I

D

5.0

A

T

A

= 70°C (Note 4)

4.0

(Note 3)

3.7

Pulsed Drain current

V

GS

= 10V

(Note 5)

I

DM

23 A

Continuous Source current (Body diode)

(Note 4)

I

S

4.0 A

Pulsed Source current (Body diode)

(Note 5)

I

SM

23 A




Thermal Characteristics

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Value

Unit

Power dissipation
Linear derating factor

(Note 3)

P

D

1.56
12.5

W

mW/

°C

(Note 4)

2.81
22.5

Thermal Resistance, Junction to Ambient

(Note 3)

R

θJA

80.0

°C/W

(Note 4)

44.5

Thermal Resistance, Junction to Lead

(Note 6)

R

θJL

37.0

Operating and storage temperature range

T

J

, T

STG

-55 to 150

°C

Notes:

2. AEC-Q101 V

GS

maximum is

±16V.

3. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is

measured when operating in a steady-state condition.
4. Same as note (3), except the device is measured at t

≤ 10 sec.

5. Same as note (3), except the device is pulsed with D= 0.02 and pulse width 300 µs. The pulse current is limited by the maximum junction temperature.
6. Thermal resistance from junction to solder-point (at the end of the drain lead).
7. UIS in production with L = 3.0mH, I

AS

= 5.0A, R

G

= 25

Ω, V

DD

=50V, starting T

J

= 25°C.














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